Matching structure of combined mold and punching machine for manufacturing flexible circuit board

Abstract

The invention discloses a matching structure of a combined mold and a punching machine for manufacturing a flexible circuit board, and belongs to the technical field of equipment for machining an electronic product. The combined mold comprises an upper mold and a lower mold; the punching machine comprises a pressing machine platform, a lower mold frame and an upper mold frame corresponding to the position above the pressing machine platform; the upper mold is arranged on the upper mold frame, and the lower mold is arranged on the lower mold frame, and corresponds to the upper mold; the surface of one side on the lower mold frame towards the upper mold frame is provided with a lower-mold drawer mechanism; the surface of one side on the upper mold frame towards the lower mold frame is provided with an upper-mold drawer mechanism which corresponds to the lower-mold drawer mechanism; the upper mold is matched with the upper-mold drawer mechanism; the lower mold is matched with the lower-mold drawer mechanism; a lower-mold handle is fixed on the lower mold; and an upper-mold handle is fixed on the upper mold. The matching structure disclosed by the invention has the advantages that since the lower mold frame is provided with the lower-mold drawer mechanism and the upper mold frame is provided with the upper-mold drawer mechanism, when the upper mold and the lower mold need to be replaced, the upper mold and the lower mold only need to be drawn out of the upper-mold drawer mechanism and the lower-mold drawer mechanism in a drawer effect, so that convenience for mold changing is guaranteed, the mold changing efficiency is increased, and the operating intensity of workers is reduced; and since the upper-mold handle and the lower-mold handle are provided, the convenience is brought for operators to grab.

Description

technical field [0001] The invention belongs to the technical field of equipment for processing electronic products, and in particular relates to a matching structure of a combined mold and a stamping machine for making a flexible circuit board. Background technique [0002] During the processing of flexible circuit boards (English abbreviation: FPC), it is necessary to punch holes on the flexible circuit board through the mold according to the process requirements. Taking the punched positioning holes as an example, it can provide positioning references for subsequent processes. The mold includes an upper mold and a lower mold used in combination with each other, which is called a combined mold in the industry. In the prior art, the upper mold is usually fixed to the upper mold frame of the stamping machine, and the lower mold is fixed to the press platform (also called the working platform) of the stamping machine, and the upper mold and the lower mold are guaranteed to co...

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Problems solved by technology

[0003] Fixing the upper and lower molds to the upper mold frame and the press platform respectively can fully guarantee that the punching machine can avoid the occurrence of the upper mold and / or the lower mold during the working process. Displacement situation, but there are problems such as troublesome mold change, high work intensity of workers and low efficiency of mold change, because when the combination mold is to be replaced, the upper mold must be removed from the upper mold frame first, and the lower mold must be removed from the press The platform is removed, and then the newly activated upper mold and the upper mold frame are fixed, and the newly activated lower mold is fixed to the press platform

[0004] The applicant has searched the literature, but in the published Chinese and foreign patents and non-patent literature, there is no technical revelation that can make up for the aforementioned deficiency. The applicant made a useful design and conducted experiments in the applicant's enterprise under strict confidentiality measures, and the results proved to be feasible. The technical solutions to be introduced below were produced under this background

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