High-density and integrally packaged RGB module and production method thereof
A modular and compact technology, applied in lighting devices, identification devices, components of lighting devices, etc., can solve the problems of large spacing between SMDLED brackets, inability to produce high-definition and high-density display screens, and complicated processes, so as to improve production efficiency and save money. Cost, the effect of simplifying the production process
Active Publication Date: 2012-09-26
ZHEJIANG INTELED OPTOELECTRONICS TECH
View PDF4 Cites 9 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0004] The present invention mainly solves the problem that the SMDLED packaging form in the prior art has a relatively large spacing between the SMDLED brackets due to the existence of the brackets, making it impossible to make high-definition high-density display screens, and provides a high-density integration with denser pixels, simple production, and low production cost. Package RGB module
[0005] The present invention also solves the problem that single SMD LEDs need to be pasted on the unit board one by one in the traditional SMD LED packaging, and the problems of complicated process, high cost and low efficiency are provided, and a high-density integrated circuit with simple manufacturing process, low cost and high efficiency is provided. Manufacturing method of packaged RGB module
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment
[0024] In this embodiment, a high-density integrated package RGB module, such as figure 1 and image 3 As shown, the module includes a PCB board 1, the PBC board adopts an FR4 board, and a circuit layer 2 is arranged on the PCB board. The circuit layer is composed of a plurality of pads 5 that are correctly arranged. The distance between them is 2mm, where the pads and light-emitting chips can be set according to the requirements of the display screen pixels. Each pad 5 has the same structure, and the pad has six pins. The light-emitting chip 6 is installed on the pad, and there are three light-emitting chips here, which are respectively red light, green light and blue light chips, and the three chips are respectively fixed on three pins, and the positive ends of the three light-emitting chips are respectively connected to For the other three light-emitting chips, the negative terminals of the three light-emitting chips are all connected to the pin where one of the light-emi...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention relates to a high-density and integrally packaged RGB module and a production method thereof and solves the problem that existing SMDLED packaging form can not be used to make a high-definition and high-density display screen as its support makes SMDLED support spacing larger. The module comprises a PCB board, wherein the PCB board is provided with a circuit layer which includes a plurality of closely arranged pads, the pads are connected through a line and are separately provided with a light-emitting chip, a lens layer is formed on the circuit layer by injection molding and is covered on the circuit layer and the light-emitting chips. The invention has the advantage that integral package is finished by steps of directly fixing the light-emitting chips on the PCB board, bonding wires, and carrying out injection molding and sealing glue into shape. The production method reduces light division, braiding and other technical processes, simplifies production process, saves cost, improves production efficiency, enables pixels of the display screen to be made more densely and modules to be made thinner, and has higher performances of moisture resistance and barrier.
Description
technical field [0001] The invention relates to an LED display technology, in particular to a high-density integrated packaging RGB module with denser pixels, simple manufacture and low manufacturing cost, and a manufacturing method of the RGB module. Background technique [0002] Because the packaging form of the traditionally packaged SMD LED has a certain size in space due to the existence of the bracket, and the traditional LED display unit module, it is necessary to mount a single RGB SMD LED lamp to the unit one by one. A unit display module is completed on the board, which limits the minimum display pixels of the LED display, and cannot achieve a high-definition high-density display below P3. At the same time, it is costly and inefficient to use a single SMD LED to make a display. [0003] For example, the publication number is CN101996533A, and the name is an application for the invention of an LED display unit module and its accessories, which includes a mask, a PCB...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): F21V19/00G09F9/33F21Y101/02F21Y115/10
Inventor 黎云汉李革胜连程杰
Owner ZHEJIANG INTELED OPTOELECTRONICS TECH