Process for manufacturing integrated circuit board
A technology of integrated circuit board and manufacturing process, which is applied in the manufacture of circuits, electrical components, semiconductors/solid-state devices, etc. It can solve the problems of waste of human resources, data loss, and cumbersome process flow of producers, so as to optimize the production process and improve efficiency , reduce the effect of the production process
Inactive Publication Date: 2012-10-03
NETRON SOFT-TECH ZHUHAI CO LTD
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Problems solved by technology
This process needs to burn a single IC before surface mounting, and then start the open and short circuit test after mounting. May be lost in surface mount process flow
Method used
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[0022] An integrated circuit board manufacturing process includes the following steps: IC feeding—surface mounting—punching—integrated testing—delivery.
[0023] First of all, IC feeding is carried out, and the prepared blank IC chip is put into the SMT equipment.
[0024] Then surface mount, the feed IC chip is mounted on the FPC board by SMT (Surface Mount Technology) equipment. Surface mounting is carried out according to the following steps: solder paste printing - parts mounting - reflow soldering - AOI optical inspection, and the above steps are all realized in special SMT equipment, according to different IC chips and different FPC boards, The process in each step will vary.
[0025] Die-cut after surface mounting, and cut the surface-mounted FPC board to the applicable size.
[0026] After that, the integrated test starts, including IC programming and IC open-short circuit test in sequence, controlled by the computer integrated test program with its own programming p...
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The invention discloses a process for manufacturing an integrated circuit board. The process comprises the following procedures: integrated circuit (IC) feeding, surface mounting, punching, integrated testing and delivering; the procedure of integrated test comprises the steps of IC burning and IC open and short circuit test which are carried out orderly; under the control of an integrated test program of a computer with a burning program and an open and short circuit test program, the burnt files in the computer are burnt into an IC chip on a punched flexible printed circuit (FPC) board to carry out the open and short circuit test to the IC chip. In the process for preparing an integrated circuit board disclosed by the invention, the process flow of integrated testing is used in the preparation of integrated circuit boards, so that IC burning and open and short circuit test can be continuously and orderly carried out in the same procedures; the production flow of IC monomer burning is reduced; the production flow is optimized; further the efficiency is improved; and the waste of labor resource is reduced.
Description
technical field [0001] The invention relates to an integrated circuit board, in particular to an integrated circuit board manufacturing process which combines IC burning and open-short circuit test processes. Background technique [0002] An integrated circuit (Integrated Circuit) is a tiny electronic device or component. Using a certain process, the transistors, diodes, resistors, capacitors, inductors and other components required in a circuit are interconnected together, fabricated on a small or several small semiconductor wafers or dielectric substrates, and then packaged in a tube. Inside the shell, it becomes a microstructure with the required circuit functions; all the components in it have been structurally integrated, making electronic components a big step towards miniaturization, low power consumption and high reliability. It is represented by the letter "IC" in the circuit. Integrated circuits are now called IC chips in the industry. The integrated circuit boa...
Claims
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IPC IPC(8): H01L21/98
Inventor 刘惠民彭勇强
Owner NETRON SOFT-TECH ZHUHAI CO LTD