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Modular high-speed mounting head for LED (light emitting diode) mounting

A placement head and modular technology, which is applied in the direction of assembling printed circuits with electrical components, can solve the problems of complex structure, bulky size, high cost, etc., and achieve the advantages of simple structure, reasonable layout and increased placement speed Effect

Active Publication Date: 2012-10-03
HEFEI INSTITUTES OF PHYSICAL SCIENCE - CHINESE ACAD OF SCI +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The translational placement head is generally composed of a certain number of identical placement head arrays. Its structure is simple, but each placement head requires an independent motor. When the number of placement heads is large, the overall cost is relatively high
The turret-type placement head is fast in placement, but it is often complex in structure, bulky and expensive

Method used

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  • Modular high-speed mounting head for LED (light emitting diode) mounting
  • Modular high-speed mounting head for LED (light emitting diode) mounting
  • Modular high-speed mounting head for LED (light emitting diode) mounting

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Embodiment Construction

[0021] In order to further understand the technical content, characteristics and principles of the present invention, and cooperate with accompanying drawings to describe in detail as follows:

[0022] like figure 1 , 2 , 3, 4, the present invention is a modular high-speed placement head for LED placement, the placement head includes a turntable rotation mechanism, suction nozzle lifting mechanism, suction nozzle rotation mechanism, electrical protection and interface conversion device and the suction nozzle 15, the turntable rotation mechanism is composed of a mounting head holder 2, a DC servo motor 3, a turntable shaft 21, a turntable connection frame 4, a first turntable 7 and a second turntable 8, wherein the DC servo motor 3 is fixed on the mounting head fixing base 2 by screws, one end of the turntable shaft 21 is installed on the mounting head fixing base 2 through a bearing and coupled with the output end of the DC servo motor through a coupling 20, and the other end...

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PUM

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Abstract

The invention relates to the field of chip mounters of electronic assembly, in particular to an economic high-speed mounting head technology for the chip mounters. The aim of the invention is to provide a mounting head with the characteristics of reasonable structural layout, simple transmission, small overall volume, light weight, high speed and low cost. A modular high-speed mounting head for LED (light emitting diode) mounting comprises a turntable rotating mechanism, a suction nozzle lifting mechanism, a suction nozzle rotating mechanism, an electrical protection and interface conversion device, and a suction nozzle. The turntable rotating mechanism comprises a mounting head fixing seat, a direct current servo motor used for providing driving force and arranged on the mounting head fixing seat, a first turntable for keeping linkage, a second turntable, a turntable connecting frame for connecting the first turntable and the output end of the direct current servo motor, and a turntable shaft.

Description

technical field [0001] The invention relates to the field of placement machines for electronic assembly, in particular to an economical high-speed placement head technology for placement machines. Background technique [0002] Surface Mount Technology SMT is a comprehensive technology that involves electronic components, assembly equipment, welding methods and assembly auxiliary materials, and is used to assemble (also known as mounting) electronic components on printed circuit boards (PCBs). . The main equipment of the SMT assembly line is composed of screen printing machine, placement machine, dispensing machine, welding machine and various process testing equipment. The placement machine is the most critical equipment. It quickly and accurately mounts the SMD components to the pad position on the PCB through the placement head suction-displacement-positioning-placement and other actions. [0003] Existing placement machines can be roughly divided into three types from t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/30
Inventor 张勇杰毕世书叶晓东冯宝林姜涛李露陈海霞谢颖
Owner HEFEI INSTITUTES OF PHYSICAL SCIENCE - CHINESE ACAD OF SCI
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