Electric grounding device

Abstract

The invention discloses an electric grounding device which comprises a grounding body, wherein the grounding body is a hollow cylinder; a water absorption hole communicated with the inside of the cylinder is arranged on the cylinder; conductive cement is arranged in the cylinder; and at least four arc fins are uniformly arranged on the circumference of the cylinder. According to the invention, the grounding body and the soil are in close combination to realize a conductive effect; through the arc fins uniformly arranged on the circumference, the contact area between the grounding device and the soil is increased, and the conductivity is improved; the grounding body is full of conductive cement which has good conductivity and water absorption, and thus the conductivity of dry soil is greatly improved; the conductive device has the effects of simple structure, large grounding area and less grounding resistance capable of getting lower than 0.5ohm, and can be widely applied to the buildings of electric power and industrial and mining enterprises, instruments and equipment and household.

Description

technical field [0001] The invention relates to a power grounding device, which is a conductive grounding device buried underground. Background technique [0002] Grounding devices are widely used in electric power, industrial and mining enterprises, buildings, instruments and households. The grounding devices currently used are generally divided into three types: a gate-shaped grounding body and a copper plate grounding body. The gate-shaped grounding body and the copper plate grounding body occupy a large area during construction, and it is difficult to dig a hole for construction. At the same time, due to the shallow distance from the ground surface, it is easily affected by the climate, and the grounding resistance is large and unstable. The grounding resistance of these two grounding devices is generally between 3Ω and 15Ω. At the same time, due to the decline of the groundwater level in recent years, the humidity of the shallow soil layer on the surface has become...

AI Technical Summary

Problems solved by technology

The gate-shaped grounding body and the copper plate grounding body occupy a large area during construction, and it is difficult to dig a hole for construction. At the same time, due to the shallow distance from the ground surface, it is easily affected by the climate, and the grounding resistance is large and unstable.

The grounding resistance of these two grounding devices is generally between 3Ω and 15Ω. At the same time, due to the decline of the groundwater level in recent years, the humidity of the shallow soil layer on the ground surface has become smaller and smaller. The traditional grounding device construction has not been able to achieve the required value of grounding resistance.

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