Superhigh heat conduction metal-based circuit board as well as preparation method and applications thereof

Abstract

The invention provides a superhigh heat conduction metal-based circuit board as well as a preparation method thereof. A layer of AIN (aluminum nitride) ceramic coating or AIN+DLC (aluminum nitride+diamond like carbon) composite coating is coated on the surface of a metal-based plate material, such as aluminum, copper so as to form a superhigh heat conduction circuit board. The superhigh heat conduction metal-based circuit board is applied to the fields which need superhigh heat conduction, such as high-power LED (light-emitting diode) devices or modules, improves the heat conduction and heat radiation capability of a base plate as well as meets the requirements of heat conduction and dissipation of electric appliance.

Description

technical field [0001] The invention relates to a metal-based circuit board with ultra-high thermal conductivity and a preparation method thereof, belonging to the technical field of electronics. Background technique [0002] In industry, some heat sources or light sources, such as emerging LED devices or modules, often require rapid heat conduction and heat dissipation. LED has the advantages of energy saving and environmental protection, and has become the fourth generation of solid-state lighting fixtures. The development of LEDs from signal indicators to lighting fixtures needs to increase power, that is, to develop high-power chips. This needs to solve many problems, among which the heat conduction and heat dissipation of high-power chips is a technical problem that must be solved. It is an effective technical way to package high-power LEDs with circuit substrates with high thermal conductivity and heat dissipation performance. [0003] LED packaging substrates can in...

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Problems solved by technology

[0005] At present, most AlN ceramic substrates are manufactured by sintering ceramic powders. The circuit boards produced in this way have relatively high material brittleness, cannot be made into large-area circuit board products, and are not easy to process and shape; in addition, due to the sintering temperature High, the cost of sintering AlN ceramics on metal substrates is high and the product yield is low

[0006] At present, there is another way to use Al 2 o 3 (Alumina) ceramic substrate package high-power LED devices, but Al 2 o 3 The ceramic substrate is manufactured by using an electrolytic bath to prepare Al by anodic oxidation on the metal substrate. 2 o 3 As an insulating and heat-conducting layer, the coating has high cost and unstable performance. The production process consumes energy and pollutes the environment.

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