Double-sided heterojunction solar cell and preparation method
A solar cell and heterojunction technology, which is applied in the field of solar cells, can solve the problems of large contact interface and the bottleneck of conversion efficiency of heterojunction cells, etc., and achieve the effects of reducing the photosensitive area, reducing the contact area, and reducing shading loss
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Publication Date
- 2014-12-31
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Abstract
Description
technical field
[0001] The invention relates to the technical field of solar cells, in particular to a double-sided heterojunction solar cell and a preparation method thereof. Background technique
[0002] Silicon heterojunction solar cells use amorphous silicon thin films deposited on crystalline silicon substrates as emitters, but doped amorphous silicon emitter thin films can absorb part of the visible light, which affects the effective use of light by the base substrate. It is beneficial to the short-wave response of the cell and limits the conversion efficiency of the solar cell. It can be seen that reducing the light absorption of the emissive layer becomes an effective way to improve the conversion efficiency of the heterojunction solar cell. At present, wide bandgap silicon films are mainly used as the emission layer, but the cost of complex doping process is high, and the electrical properties of wide bandgap doped films cannot be guaranteed.
[0003] For heterojun...
Examples
Embodiment Construction
[0024] The present invention will now be further described in conjunction with the accompanying drawings and preferred embodiments. These drawings are all simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, so they only show the configurations related to the present invention.
[0025] Such as figure 1 A double-sided heterojunction solar cell shown includes a silicon wafer base layer 1 made of an n-type single crystal silicon wafer. The silicon wafer base layer 1 has a thickness of 200 μm and a resistivity of 5Ω. The silicon wafer base layer 1. The back has an intrinsic layer 2, a heavily doped BSF layer 3 and a back electrode 4 in order from the inside to the outside, wherein the thickness of the intrinsic layer 2 is 5nm, the thickness of the heavily doped BSF layer 3 is 20nm, and the back electrode 4 is selected The metallic aluminum film is deposited with a thickness of 1.5 μm.
[0026] The front side of...