A kind of negative leveling agent used for electroplating copper on the front electrode of solar cell
A solar cell and negative leveling technology, applied in circuits, semiconductor devices, etc., can solve the problems of reducing the light-receiving area of the battery, reducing the short-circuit current and efficiency, etc., to improve the deep plating ability, reduce the shading loss, and have a wide range of applications. Effect
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Embodiment 1
[0013] Example 1: A negative leveling agent used for electroplating copper on the front electrode of solar cells, which is a polyether non-ionic surface with a concentration of 0.05g / L sodium phenyl polydithiopropane sulfonate and a total concentration of 0.8g / L Active agent polyoxyethylene lauryl ether and anionic surfactant sodium dodecylsulfonate, wherein the mass ratio of polyoxyethylene lauryl ether to sodium dodecylsulfonate is 2:1, and the concentration is 15mg / L chloride ion, the aqueous solution of heterocyclic azo dye (direct red) with a concentration of 0.5g / L.
[0014] The negative leveling agent for electroplating copper on the front electrode of the solar cell is used in the electroplating copper thickening process of the seed layer of a single crystal silicon solar cell, and the width of the initial seed layer is 10 microns, and the height is 5 microns. Put the solar cell into the copper electroplating solution of the negative leveling agent 20mL / L of the embo...
Embodiment 2
[0015] Example 2: A negative leveling agent used for electroplating copper on the front electrode of solar cells, which contains sodium polydithiopropane sulfonate at a concentration of 0.09g / L, nonionic surfactant octanol polyoxyethylene ether and anionic surfactant Sodium dodecylbenzenesulfonate total concentration is 1.1g / L, wherein, the mass ratio of nonionic surfactant octanol polyoxyethylene ether and anionic surfactant sodium dodecylbenzenesulfonate is 4: 1. An aqueous solution with a chloride ion concentration of 19mg / L and a benzidine azo dye (Direct Black 38) concentration of 0.8g / L.
[0016] The negative leveling agent for electroplating copper on the front electrode of the solar cell is used in the electroplating copper thickening process for the seed layer of the polycrystalline silicon solar cell. The width of the initial seed layer is 28 microns and the height is 8 microns. Put the solar cell into the copper electroplating solution containing 50mL / L of the neg...
Embodiment 3
[0017] Example 3: A negative leveling agent used for electroplating copper on the front electrode of solar cells, which is a polyether non-ionic surfactant with a concentration of 0.02g / L sodium polydithiodipropane sulfonate and a total concentration of 1.3g / L Agent polyethylene glycol and anionic surfactant anionic polyimide, wherein, the mass ratio of polyethylene glycol and anionic polyimide is 1:1, the chloride ion concentration is 8mg / L, and the chloride ion concentration is 1g / L Aqueous solution of benzenesulfonanilide azo dye (Direct Black 168).
[0018] The negative leveling agent for electroplating copper on the front electrode of the solar cell is used in the electroplating copper thickening process for the seed layer of a single crystal silicon solar cell, and the width of the initial seed layer is 14 microns and the height is 6.5 microns. Put the solar cell into the copper electroplating solution containing the negative leveling agent 5mL / L of this embodiment for...
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