Driver

Abstract

The invention provides a driver which comprises a PCB (Printed circuit board) and a power device. The first surface and the second surface of the PCB are correspondingly provided with a first copper foil and a second copper foil; the power device is mounted on the first copper foil; a metal cooling plate is arranged below the second copper foil; a heat-conducting and electric-conducting connecting body is arranged in a through hole on the PCB; and the metal cooling plate is connected with a pin and / or the first copper foil of the power device through the connecting body. The driver has a good cooling effect. The metal cooling plate has a current-carrying effect, so that the current-carrying capacity of the driver can be improved, and the purpose that a small space carries large current can be achieved; the metal cooling plate is welded on the bottom surface of the second copper foil, thereby being convenient to assemble; with the adoption the metal cooling plate, and the metal cooling plate increases the rigidity of the PCB, so that the force-deformation of the PCB board cannot occur during assembly.

Description

technical field [0001] The invention relates to the technical field of drives, in particular to a drive for driving high-power electronic or electrical equipment. Background technique [0002] When the drives used in electronic or electrical equipment such as motors or inverters are working, their built-in power chips will continue to generate a lot of heat; if the heat is not dissipated in time, the performance of the drives will decrease, or even overheat and burn out. Therefore, the design of the heat dissipation structure of the driver is one of the important factors affecting the performance of the driver. [0003] In traditional technology, if the driver has enough space, the effective heat dissipation of the driver can be achieved by setting cooling fans, heat sinks and other technical means; but in recent years, with the development of microelectronics technology, circuit boards and electronic components are increasingly integrated. The equipment is also increasingl...

AI Technical Summary

Problems solved by technology

[0003] In traditional technology, if the driver has enough space, the effective heat dissipation of the driver can be achieved by setting cooling fans, heat sinks and other technical means; but in recent years, with the development of microelectronics technology, circuit boards and electronic components are increasingly integrated. The equipment is also increasingly miniaturized; therefore, the equipment has the limitation of structural size and space, and the driver needs to realize the drive of relatively high-power electronic or electrical equipment in a small space; install more power devices on a smaller circuit board , making the heat dissipation and routing design of the driver very difficult, which limits the miniaturization application of high-power drivers

Images