Online adjustable fixture for polishing machine tool

Abstract

The invention discloses an online adjustable fixture for a polishing machine tool, and relates to a work fixture. The online adjustable fixture is provided with a base plate and at least three sets of clamping and regulation mechanisms which have the same structure. The clamping and regulation mechanisms are centrifugally and uniformly arranged on the surface of the base plate by taking the central axis of the base plate as a reference. Each clamping and regulation mechanism is provided with a horizontal sliding block, a horizontal cylinder, a perpendicular sliding block, a perpendicular cylinder, a perpendicular pressure sensor and a horizontal pressure sensor, wherein the response speed of the horizontal pressure sensor is adjustable; the horizontal sliding block is matched with the base plate in a centrifugal sliding way; a piston rod of the horizontal cylinder is connected with the horizontal sliding block; the perpendicular sliding block is arranged on the horizontal sliding block, and is matched with the horizontal sliding block in a perpendicular sliding way; the perpendicular cylinder is arranged on the horizontal sliding block; a piston rod of the perpendicular cylinder is connected with the perpendicular sliding block; the perpendicular pressure sensor is arranged on the horizontal surface of a clamping part of the perpendicular sliding block; and the horizontal pressure sensor is arranged on the perpendicular surface of the clamping part of the perpendicular sliding block. The horizontal position of the machined surface of a workpiece can be regulated on line (in real time), so that the machined surface of the workpiece can be uniformly stressed to be matched with the polishing machine tool.

Description

technical field [0001] The invention relates to a tooling fixture, in particular to an online adjustable fixture for a polishing machine tool matched with a polishing machine tool. Background technique [0002] In the manufacture of ultra-large-scale integrated circuits (ULSI), chemical mechanical polishing (CMP) has become a practical and core technology for global planarization of silicon wafers in the semiconductor processing industry. With the development of very large scale integrated circuits, the size of silicon wafers continues to increase, and the requirements for surface accuracy are getting higher and higher. The main factor affecting the surface accuracy of silicon wafers is the non-uniformity of material removal on the surface of silicon wafers. One of the biggest problems with CMP is wafer material removal non-uniformity, which is an important indicator of the need for wafer surface planarization in integrated circuits. The size of material removal non-uniform...

AI Technical Summary

Problems solved by technology

The traditional polishing device has strict requirements on the size and surface of the workpiece. One fixture can only correspond to a workpiece of one size. When the surface of the workpiece is uneven, it will lead to uneven distribution of the working load and affect the polishing effect, and even cause the workpiece to fly out, which is relatively safe. Difference

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