Method for bonding rubber component
A technology for bonding rubber and components, applied in the direction of adhesives, adhesive types, chloroprene adhesives, etc., can solve the problem of bonding metal and rubber materials, inevitable glue overflow or lack of glue, and affect product appearance Quality and other problems, to achieve the effect of eliminating hidden dangers of quality, overcoming insufficient adhesion, and convenient operation
Active Publication Date: 2012-10-31
AVIC NO 631 RES INST
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AI Technical Summary
Problems solved by technology
[0002] In the computer field, it is often necessary to bond metal parts and rubber parts, but rubber components are low surface energy materials, and it is difficult to bond metal and rubber materials. At present, curing adhesives are generally used for bonding. In glued assembly Glue overflow or lack of glue is inevitable, which not only affects the appearance quality of the product but also brings unpredictable quality hidden dangers
There are also some rubber components bonded with pressure-sensitive adhesive film, but it will show that the adhesive force of the film is insufficient
Method used
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Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0029] Example 1: Bonding a rubber plate on a conductive oxidized aluminum piece. The adhesive is neoprene-phenolic adhesive 801 and acrylic pressure-sensitive adhesive film 9473. After testing, its bonding strength is twice that of 801 glue alone. 4 times that of 9473 film, and there is no glue overflow or lack of glue after the product is bonded.
Embodiment 2
[0030] Example 2: Bonding a rubber ring on a hard anodized aluminum piece, the adhesive is chloroprene-phenolic adhesive 801 and acrylic pressure-sensitive adhesive film W-2174-CII, and its bonding strength is tested by using 801 glue alone 2 times, 4 times that of W-2174-CII film alone, and there is no glue overflow or lack of glue after the product is bonded.
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The invention relates to a method for bonding a rubber component. The method comprises the following steps of: carrying out surface treatment on the rubber component; cleaning a bonding surface of the rubber component by using a solvent; infiltrating the rubber surface by using a neoprene-phenolic aldehyde adhesive; and placing the rubber component until the surface of the rubber component is semi-cured, etc. The invention provides the method for bonding the rubber component, which solves a technical problem that rubber shortage or rubber overflow is easy to generate by singly using a curing adhesive or the bonding force is insufficient by singly using a pressure sensitive adhesive film. Through the adoption of the method provided by the invention, a neoprene-phenolic aldehyde adhesive infiltrated rubber adhesive film is formed on the surface of the rubber component, so that the rubber surface energy is increased, coarseness is reduced, the bonding area of the rubber film is increased, and rubber shortage or rubber overflow is avoided after semi-curing.
Description
technical field [0001] The invention belongs to the technical field of computer reinforcement and relates to the bonding of rubber components. Background technique [0002] In the computer field, it is often necessary to bond metal parts and rubber parts, but rubber components are low surface energy materials, and it is difficult to bond metal and rubber materials. At present, curing adhesives are generally used for bonding. In glued assembly Glue overflow or lack of glue is inevitable, which not only affects the appearance quality of the product but also brings unpredictable quality hidden dangers. There are also some rubber components bonded with pressure-sensitive adhesive film, but the adhesive force of the adhesive film will be insufficient. Contents of the invention [0003] In order to avoid the technical problems of insufficient glue or glue overflow when using curable adhesive alone, or insufficient adhesion of pressure-sensitive adhesive film alone, the present ...
Claims
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Patent Timeline
Login to View More IPC IPC(8): C08J5/12C09J111/00C09J161/06C09J133/00
Inventor 何燕春石红崔景新曲亮喻少英
Owner AVIC NO 631 RES INST