Magnetic sensor easy to encapsulate
A magnetic field sensor and support column technology, applied in the field of sensors, can solve problems affecting sensor performance, wire interaction, etc., and achieve the effects of low power consumption, high sensitivity and high precision
Inactive Publication Date: 2014-06-25
SOUTHEAST UNIV
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Problems solved by technology
The packaging of the magnetic field sensor has an important impact on the performance of the sensor. Since the metal wire can be subjected to the Lorentz force under the action of the magnetic field, improper leads may cause the interaction of the wires and affect the performance of the sensor.
Method used
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[0016] specific implementation plan
[0017] The technical solution of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0018] like figure 1 and figure 2 As shown, a magnetic field sensor that is easy to package of the present invention includes four cantilever beams 3, cantilever beam anchor regions 5, first support pillars 6, metal layer 7, silicon oxide film layer 8 and silicon film layer 9, and the cantilever beam The anchor area 5 is fixed on the top surface of the first support column 6 . The first support pillar 6 is columnar and made of silicon oxide. Four cantilever beams 3 are in the shape of a cross and are fixed on the side walls of the cantilever beam anchorage area 5; a circle of metal wires 2 is provided on the top surface of each cantilever beam 3; Eight connecting vias 1 . Each connecting via 1 is provided with a first metal column, and the first metal column connects the end of the metal line 2 wi...
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The invention discloses a magnetic sensor easy to encapsulate, which includes four cantalevers, a cantilever anchor area, a first support pillar, a metal layer, a monox film and a silicon film, wherein the cantilever anchor area is fixed on the top surface of the first support pillar; the four cantalevers are crossed and fixed on the side wall of the cantilever anchor area; a circle of metal wire is arranged on the top surface of each cantilever; eight connection through holes are arranged at the cantilever anchor area and the first support pillar; the metal layer is connected with the metal wire through the connection through holes; the monox film is fixed on the top surface of the silicon film; the metal layer is fixed on the top surface of the monox film; the first support pillar is fixed on the top surface of the metal layer; eight bonding pads are positioned on the outer sides of the cantalevers; second support pillars are arranged between the bonding pads and the metal layer; connection holes are arranged in the second support pillars; and the metal layer is connected with the bonding pads of a sensor through the connection holes. The magnetic sensor is convenient to encapsulate, and reduces the influence of leading wires on the performance of the sensor.
Description
technical field [0001] The invention belongs to the technical field of sensors, and in particular relates to an easily packaged magnetic field sensor. Background technique [0002] Magnetic field sensors have a long history. The invention of the compass has a wider application field. Intelligent communication, traffic navigation, data storage, etc. all require the use of magnetic field sensors. [0003] With the development of micro-electromechanical systems (MEMS) technology, the development of MEMS magnetic field sensors has been greatly promoted, and some micro-magnetic field sensor structures have appeared. The mass production of silicon technology has greatly reduced the cost of expensive design and manufacturing. At the same time The newly developed MEMS process can make various mechanical structures on the silicon substrate using the IC post-processing process, which opens up a new way for the design of magnetic field sensors. In recent years, some MEMS micro-magnet...
Claims
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IPC IPC(8): G01R33/02B81B3/00
Inventor 陈洁黄庆安秦明
Owner SOUTHEAST UNIV