Loading and unloading basket device for silicon wafers

Abstract

The invention relates to a loading and unloading basket device for silicon wafers, which includes an up and down motor of a material box, a material box, a first sensor, a blowing device, vacuum cups, a carbon fiber plate, a rotating cylinder, an elevating cylinder, a rotating motor, pulleys, a belt, a second sensor, an elevating motor of a basket, and a basket, wherein the carbon fiber plate is mounted on the rotating cylinder; two groups of vacuum cups are mounted on the carbon fiber plate; the elevating cylinder is used for lifting and dropping the rotating cylinder and the carbon fiber plate together, and the carbon fiber plate is rotated and moved by the rotating cylinder; the first sensor and the blowing device are respectively mounted on both sides at the upper part of the material box, the first sensor detects the lifting height of the silicon wafers, and the blowing device separates the stacked silicon wafers through blowing; the second sensor is mounted on one side in the basket tooth direction that the belt transmits silicon wafers into the basket, and transmits a signal for enabling the elevating motor of the basket to move upwards when insertion of the silicon wafers into the basket tooth of the basket is detected; and the elevating motor of the basket move upwards for a basket tooth pitch distance after receiving the signal.

Description

technical field [0001] The invention relates to the field of automatic control, in particular to a silicon wafer loading and unloading basket device. Background technique [0002] The currently used silicon wafer inserting machine uses a vacuum suction cup to absorb the silicon wafer, and then moves the silicon wafer through a linear cylinder or a motor drive. After moving to the position, the vacuum is released to release the silicon wafer, and the belt drives the silicon wafer to be transported and inserted into the basket. Its disadvantages are: 1. The transmission distance is long, the speed of loading and unloading silicon wafers becomes slow, and the work efficiency will be very low; 2. Such machines are expensive and bulky. 3. The chip insertion machine only has the function of inserting silicon chips, but not the function of unloading silicon chips from the basket. Contents of the invention [0003] In order to solve the above problems, the present invention provi...

AI Technical Summary

Problems solved by technology

The disadvantages are: 1. The transmission distance is long, the speed of loading and unloading silicon wafers is slowed down, and the work efficiency will be very low; 2. Such machines are expensive and bulky

3. The insertion machine only has the function of inserting silicon wafers, but not the function of unloading silicon wafers from the basket

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