Heat radiator

Abstract

The invention discloses a heat radiator which comprises a bearing base and a plurality of heat-dissipation fins. The bearing base comprises a pipe body which is defined with an upper opening and a lower opening, and a first fixing part which is formed at the pipe body and next to the upper opening. The plurality of the heat-dissipation fins surround the pipe body arranged at the bearing base, wherein each heat-dissipation fin comprises a fin body, and a second fixing part formed in the fin body and fixed at the first fixing part of the bearing base; and each of the second fixing parts is provided with a stretching section formed through stretching and bending of each fin body, and a clamping hook convexly stretching from the stretching section and buckled on the first fixing part of the bearing base. As the second fixing parts of the heat-dissipation fins are matched with the first fixing part of the bearing base, a heat-dissipation effect can be achieved after assembling.

Description

technical field [0001] The invention relates to a heat sink, in particular to a heat sink which is easy to assemble. Background technique [0002] LED has the advantages of low power, high luminous efficiency, good energy-saving effect, long service life and no pollution, so it has been widely used in daily life; it is common to install multiple LEDs in a lamp for lighting. Because LEDs will generate temperature when they work, lamps with multiple LEDs are prone to generate high heat accumulation during the lighting process. If they are not dissipated in time, LEDs will suffer from color shift, reduced brightness, and shortened service life. And problems such as immediate failure. Therefore, the heat dissipation of LEDs has always been an important issue. [0003] For example, Taiwan’s new patent No. M395787 discloses a heat dissipation module, which mainly uses the wedge grooves and wedges located under each heat dissipation fin to cooperate with each other to form a ring...

AI Technical Summary

Problems solved by technology

[0004] Although the heat dissipation module mentioned above can achieve the expected heat dissipation effect, the processing of the heat dissipation fins of this type of heat sink is complicated, requiring additional procedures and cost expenditures

Furthermore, the way of connecting and assembling the wedge grooves and wedges of adjacent heat dissipation fins is not stable in terms of stability, because each heat dissipation fin is already an extremely thin sheet, let alone the one located on the heat dissipation fin. The wedge grooves and wedges are easy to be damaged due to careless operation during the assembly process, which affects the mutual assembly function, making the heat sink unable to form

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