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Sisal hemp glass fiber composite reinforced organosilicone modified phenolic aldehyde molding material and preparation method thereof

A technology of phenolic molding compound and glass fiber, which is applied in the field of organosilicon-modified phenolic molding compound and its preparation, can solve the problems of difficult long-term storage of phenolic molding compound, and achieve improved water absorption and weather resistance, good toughness and insulation performance , the effect of small energy consumption

Active Publication Date: 2013-09-25
ZHEJIANG UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The Chinese patent with the publication number CN101974199A discloses a low-shrinkage phenolic molding compound, which uses thermosetting novolac resin as the matrix, adds glass fiber and cotton fiber at the same time, and uses nano-scale inorganic fillers to comprehensively improve the strength and shrinkage resistance of the material. , but due to the use of thermosetting novolac resin as the matrix, the resulting phenolic molding compound is difficult to store for a long time

Method used

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  • Sisal hemp glass fiber composite reinforced organosilicone modified phenolic aldehyde molding material and preparation method thereof
  • Sisal hemp glass fiber composite reinforced organosilicone modified phenolic aldehyde molding material and preparation method thereof
  • Sisal hemp glass fiber composite reinforced organosilicone modified phenolic aldehyde molding material and preparation method thereof

Examples

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Effect test

preparation example 1

[0042] (1) Preparation of organosilicon modifier: Add eugenol (164kg, 1000mol) and 15g of chloroplatinic acid into a synthesis reaction kettle, stir and heat up to 55-65°C, and 1,1,3,3-tetramethyldi Siloxane (67kg, 500mol) is added dropwise into the reactor in batches to keep the temperature not higher than 80°C, and the reaction proceeds until the end of the temperature rise phenomenon and then continues for 2-3 hours to make a silicone modifier. The structural formula and nuclear magnetic spectrum of the silicon modifier are as follows figure 1 As shown, the productive rate is 93%, and the structural formula and nuclear magnetic spectrum of this organosilicon modifier are as follows figure 1 shown.

[0043] (2) Preparation of organosilicon-modified thermoplastic phenolic resin: Add 80kg of phenol and 10kg of organosilicon modifier prepared by the above method into the synthesis reaction kettle, heat up and stir, add appropriate amount of oxalic acid to adjust the pH<2, and ...

preparation example 2

[0046] (1) Preparation of organosilicon modifier: Add eugenol (82kg, 500mol) and 9g of chloroplatinic acid into the synthesis reaction kettle, stir and heat up to 55-65°C, and 1,1,3,3-tetramethyldi Siloxane (33.5kg, 250mol) was added dropwise into the reaction kettle in batches, keeping the temperature not higher than 80°C, and the reaction continued for 2-3 hours after the end of the heating phenomenon, and then the organosilicon modifier was prepared. Yield 94%.

[0047] (2) Preparation of organosilicon-modified thermoplastic phenolic resin: add 100kg of phenol and 10kg of organosilicon modifier prepared by the above method to the synthesis reaction kettle, add oxalic acid to adjust the pH of the system to about 2, heat up and stir, and the temperature rises to about Add 55 kg of 37% formaldehyde solution dropwise at 85°C and keep it warm for 2 hours until the system becomes turbid, then vacuumize and dehydrate under reduced pressure under heating until the system temperatur...

preparation example 3

[0050] (1) Preparation of organosilicon modifier: Add 2-allylphenol (133kg, 1000mol) and 15g of chloroplatinic acid into the synthesis reaction kettle, stir and heat up to 55-65°C, and mix 1,1,3,3- Tetramethyldisiloxane (67kg, 500mol) is added dropwise into the reactor in batches to keep the temperature not higher than 80°C, and the reaction is carried out until the end of the heating phenomenon, and then continues for 2-3 hours, and then the organosilicon modification is made. agent, the yield was 91%.

[0051] (2) Preparation of organosilicon-modified thermoplastic phenolic resin: add 80kg of phenol and 10kg of organosilicon modifier prepared by the above method to the synthesis reaction kettle, add oxalic acid to adjust the pH of the system to about 2, heat up and stir, and the temperature rises to about Add dropwise 45 kg of 37% by mass formaldehyde solution at 85°C and keep it warm for 2 hours until the system becomes turbid, then vacuumize and dehydrate under reduced pre...

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Abstract

The invention discloses a sisal hemp glass fiber composite reinforced organosilicone modified phenolic aldehyde molding material which comprises 35-70% of organosilicone modified thermoplastic phenolic resin, 5-45% of glass fiber and sisal hemp mixed fiber, 5-45% of packing material, 0.5-3% of demolding agent, 0.25-1.5% of coloring agent and 2-10% of curing agent. The invention further provides a preparation method of the sisal hemp glass fiber composite reinforced organosilicone modified phenolic aldehyde molding material. The sisal hemp glass fiber composite reinforced organosilicone modified phenolic aldehyde molding material is prepared by mixing the components, smashing or granulating and other working procedures. The phenolic aldehyde molding material prepared by using the method is long in storage time, not apt to become damp, excellent in weather fastness, small in relative density and low in production cost; and the cured material is excellent in toughness and heat resistance. Plastic parts made of the organosilicone modified phenolic aldehyde molding material have the characteristics of being long in storage time, good in toughness, small in relative density, and excellent in heat resistance.

Description

technical field [0001] The invention relates to the field of phenolic molding compounds, in particular to an organosilicon-modified phenolic molding compound and a preparation method thereof. Background technique [0002] Phenolic molding compound is a thermosetting plastic material prepared mainly from thermoplastic phenolic resin and other fillers. It has the characteristics of low price, excellent mechanical properties, good insulation performance, and easy and quick molding. It is widely used in military industry, electrical components, instruments, and buildings. and other fields. However, this type of material also has defects such as brittleness, difficulty in storage, and limited heat resistance. [0003] The Chinese patent with the notification number CN1175042C discloses a high-temperature-resistant inorganic fiber-reinforced injection-type phenolic molding compound. Ordinary phenolic resin is used as a matrix, although the mechanical properties and heat resistan...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L61/14C08K13/04C08K7/14C08J5/04C08G8/28
Inventor 范宏李诚卜志扬李伯耿
Owner ZHEJIANG UNIV
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