A kind of magnetron, the manufacturing method of magnetron and physical deposition chamber

Abstract

The invention provides a magnetron, a manufacturing method of the magnetron and a physical deposition room applying the magnetron. The magnetron provided by the invention comprises an inner magnetic pole and an outer magnetic pole, which have the opposite polarity directions and can rotate around a center shaft of a target; the inner magnetic pole is arranged inside the outer magnetic pole; a magnetic field track in a closed curve shape is formed between the inner magnetic pole and the outer magnetic pole; the radius of any angle emitted from the center shaft and the magnetic field track just have intersection once, and the magnetic field track enables the magnetic field scanning strengths obtained by any unit area of the target surface to be roughly equal when the magnetron rotates around the center shaft, thereby effectively improving the utilization rate of the target and the homogeneity of the process. The magnetron manufactured by the magnetron manufacturing method provided by the invention and the physical deposition room provided by the invention can effectively improve the target utilization rate and the process homogeneity.

Description

technical field [0001] The invention relates to the technical field of microelectronic processing, in particular to a magnetron, a method for manufacturing the magnetron, and a physical deposition chamber using the magnetron. Background technique [0002] In recent years, with the rapid development of the microelectronics industry, technicians need to continuously improve and update related processing techniques and equipment. Among them, the improvement of magnetron sputtering equipment is highly valued by enterprises and related technical personnel. [0003] see figure 1 , is a schematic diagram of the structure of a typical magnetron sputtering device. The equipment mainly includes: a process chamber 1 , an electrostatic chuck 3 arranged inside the process chamber 1 , a target 2 arranged above the process chamber 1 , a magnetron 4 and a drive motor 5 for the magnetron. A suction device 13 is connected to the lower end or side wall of the process chamber 1 . In the mag...

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Problems solved by technology

However, the effect of the magnetron in practical applications is not ideal. This conclusion can be clearly drawn from the target corrosion curve obtained by using the magnetron, specifically: the magnetron with the above structure is used to During the sputtering process, the erosion in the radial direction of the target is not uniform enough, and when the material at any position on the target is used up, a new target must be replaced, which will cause a serious waste of target materials, which not only increases The production cost of the enterprise, and the uniformity of the process quality will be seriously affected due to the uneven corrosion of the target material

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