Heat dissipation device and electronic device using the heat dissipation device

Abstract

The invention relates to an electronic device which comprises a radiator, a circuit board, a first electronic component and a second electronic component, wherein the first electronic component and the second electronic component are arranged on the circuit board; the radiator comprises a centrifugal fan, a heat dissipation fin group and a heat pipe; the centrifugal fan is provided with an air outlet; the heat dissipation fin group is arranged at the air outlet of the centrifugal fan; the heat pipe comprises an evaporation section and a condensation section extending from the evaporation section; the condensation section is connected with the heat dissipation fin group; the evaporation section is used for being in thermal contact with the first electronic component and the second electronic component; the centrifugal fan comprises a fan frame; a spring plate is arranged on the fan frame; and the spring plate is pressed against the upper part of the evaporation section of the heat pipe to ensure the evaporation section to have a downward pressure. According to the invention, by additionally arranging the spring plate on the fan frame and ensuring the spring plate to be abutted against the heat pipe, a downward force is generated to the evaporation section by the spring plate, so that heat generated by a heating element is better transferred onto the radiator, the heat dissipation efficiency is improved, the assembling working hours are reduced and the cost is reduced.

Description

technical field [0001] The invention relates to a heat dissipation device and an electronic device using the heat dissipation device. Background technique [0002] At present, in computer products, the heat generated by the CPU and chips on the circuit board during the working process is constantly increasing, so they need to be dissipated simultaneously. A commonly used heat sink generally includes a heat sink, a heat pipe, a fan, and a heat sink group formed by stacking heat sinks. The heat sink includes a first heat sink and a second heat sink connected to the first heat sink. plate, the first heat absorbing plate is attached to a CPU, and the second heat absorbing sheet is attached to the chip to absorb the heat generated by them, and the heat is transferred to the heat pipe through the heat absorbing frame, and then transferred to the heat dissipation fins group, and the heat is dissipated by the cooling fin group and the fan. [0003] At present, it is generally to d...

AI Technical Summary

Problems solved by technology

Chips without locking holes around them will rely on the second heat absorbing plate to be pressed against it to absorb its heat, but because the pressing force is non-uniform, it is easy to cause poor contact between the second heat absorbing plate and the chip, or In order to make good contact between the second heat-absorbing plate and the chip, the pressure between the first heat-absorbing plate and the CPU is too high and the CPU is crushed; but if there are many heat-generating electronic components, drill and lock around all the heat-generating electronic components These holes must be avoided during wiring and design, which increases the difficulty of electronic circuit layout and affects the continuity of electronic circuits

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