Magnetic detection apparatus

A magnetic detection device and the technology of the detection device are applied in the directions of measurement devices, electric devices, and electric/magnetic devices to transmit sensing components, which can solve problems such as the deterioration of the reliability of the output voltage of the detector.
CN102809385AInactive Publication Date: 2012-12-05DENSO CORP

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
DENSO CORP
Publication Date
2012-12-05
Estimated Expiration
Not applicable · inactive patent

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Abstract

A magnetic detection apparatus (1) includes an IC device (2), a casing (3) defining a housing space (9) of the IC device, and a resin mold portion (4) arranged on a first part of an outside surface (17) of the casing. The IC device includes an IC package (5) having a built-in magnetoelectric transducer, and lead wires (6). The housing space is defined by a second part of an inner wall of the casing. A predetermined portion of the second part of the inner wall is defined as a contact region (L0-L4), with which the IC device contacts. The resin mold portion is arranged other than a predetermined portion of a second part of the outside surface corresponding to the contact region. A position of the magnetoelectric transducer is determined by positions of the contact region and the resin mold portion.
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Description

technical field

[0001] The present disclosure relates to a magnetic detection device having a magnetoelectric transducer such as a Hall element. Background technique

[0002] Conventionally, a magnetic detection device having a magnetoelectric transducer such as a Hall element is used to detect a rotation angle or a linear displacement. As disclosed in JP-A-2004-004114 (which corresponds to USP 6,407,503), the magnetic detection device includes an integrated circuit (IC) device molded with a resin material by injection molding. The IC device includes an IC package disposed inside the IC device. In this IC package, a magnetoelectric transducer and a processing circuit such as an amplification circuit are built. The position of the magnetoelectric transducer is defined and stabilized by molding the IC device. When molding an IC device, injection pressure caused by resin injection is applied to an IC package disposed within the IC device. Therefore, the characteristics of t...

Claims

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