Impedance Control Method
A technology of impedance control and multi-layer circuit board, applied in the direction of printed circuit components, etc., can solve the problems of signal distortion, transmission line impedance increase, and affect signal accuracy, etc., to achieve the effect of controlling impedance, simple operation, and improving signal transmission quality
Active Publication Date: 2016-06-01
SHENZHEN TOP FLIGHT TECH CO LTD
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However, it has been found through testing that when the transmission line is too close to the edge of the circuit board, the impedance of the transmission line will easily increase, which will affect the accuracy of the transmission signal transmitted by the transmission line, and even cause signal distortion
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[0013] A preferred embodiment of the present invention provides an impedance control method, which is suitable for multi-layer circuit boards. Please also refer to figure 1 , in this embodiment, the multilayer circuit board 100 is a four-layer circuit board, wherein the first layer in the multilayer circuit board 100 is the signal layer S01, the second layer is the power layer POWER, and the third layer is the ground layer GND , the fourth layer is the signal layer S02. Wherein, the portion of the multi-layer circuit board 100 with oblique lines is copper skin, and the rest is composed of dielectric. In addition, in this embodiment, the thickness of the signal layer S01 is 1.9 mil, the thickness of the power layer POWER is 1.2 mil, the thickness of the ground layer GND is 1.2 mil, and the thickness of the signal layer S02 is 1.9 mil. The transmission line 11 is provided on the signal layer S01. The transmission line 11 is arranged at a certain distance from the edge of the ...
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An impedance control method includes steps of establishing an simulation model in simulation software according to a structure of a multi-layer circuit board; setting the distance from a center line of a transmission line to the edge of the multi-layer circuit board as a first variable and setting the width of the transmission line as a second variable in the simulation model; enabling the first variable to be equal to a first preset value according to requirements of users; enabling impedance of the transmission line to be equal to a second preset value according requirements of users; scanning parameters of the second variable, enabling the second variable to change according to a certain functional relation expression so as to acquire a width value of the transmission line corresponding to the first preset value and the second preset value; and setting the width of the transmission line on the multi-layer circuit board as the width value according to the acquired parameter value, and enabling the distance from the center line of the transmission line to the edge of the multi-layer circuit board to be equal to the first preset value.
Description
technical field [0001] The invention relates to a circuit impedance control method, in particular to an impedance control method for multilayer circuit board transmission lines. Background technique [0002] A four-layer circuit board is a relatively common multi-layer circuit board. The first and fourth layers of the four-layer circuit board are generally set as signal layers, while the second and third layers are generally set as power layers and ground layers, respectively. When designing a multi-layer circuit board, at least one transmission line is generally arranged on the first layer for high-speed signal transmission. However, it is found through testing that when the transmission line is too close to the edge of the circuit board, the impedance of the transmission line is likely to increase, thereby affecting the accuracy of the transmission signal transmitted by the transmission line, and even causing signal distortion. Contents of the invention [0003] In view...
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IPC IPC(8): H05K1/02
Inventor 吴信宽周厚原
Owner SHENZHEN TOP FLIGHT TECH CO LTD