Circuit board assembly for contact image sensors and manufacturing method thereof

Abstract

The invention relates to a circuit board assembly for contact image sensors and a manufacturing method thereof. The circuit board assembly is characterized in that: a substrate is provided with a through groove, the two sides of one end (matched with the substrate) of a light source circuit board are provided with signal connection points, the two sides of the through groove are respectively provided with signal connection points of the substrate corresponding to the signal connection points of the light source circuit board one by one, the light source circuit board is perpendicular to the substrate and passes through the through groove of the substrate, and the signal connection points of the light source circuit board are connected with the corresponding signal connection points of the substrate by way of welding through welding fluxes. The manufacturing method comprises the following steps of: forming a through groove on a substrate; setting signal connection points on the two sides of one end (matched with the substrate) of a light source circuit board, and respectively setting signal connection points of the substrate corresponding to the signal connection points of the light source circuit board one by one on the two sides of the through groove; enabling the light source circuit board to passes through the through groove of the substrate and be perpendicular to the substrate, and welding the signal connection points of the light source circuit board on the corresponding signal connection points of the substrate through welding fluxes. The circuit board assembly for contact image sensors and the manufacturing method thereof disclosed by the invention are simple in production process and low in production cost, and can be widely applied to the field of contact image sensors.

Description

technical field [0001] The invention belongs to the technical field of contact image sensors, and in particular relates to a circuit board assembly of a contact image sensor and a manufacturing method thereof. Background technique [0002] figure 1 It is a schematic diagram of the connection between the substrate of the traditional contact image sensor and the light source of the contact image sensor. In the figure, 1 is the substrate of the contact image sensor, 2 is the LED board of the light source of the contact image sensor, and 3 is the signal pin of the light source. , 4 is solder, 5 is a signal connection point with a round hole on the substrate. like figure 1 As shown, the signal pin 3 of the light source passes through the signal connection point 5 with the round hole on the substrate 1, and the pin 3 of the light source and the signal connection point 5 are soldered together with solder 4, so that the contact image is realized The connection between the substra...

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Problems solved by technology

[0004] The technical problem to be solved by the present invention is: since the new contact image sensor adopts the light source of the circuit board structure, the connection technology of the substrate and the light source of the traditional contact image sensor and the existing circuit board connection technology cannot solve the problem of contact type image sensor. The problem of the vertical connection between the substrate of the image sensor and the circuit board of the light source, a circuit board assembly of a contact image sensor and its manufacturing method are proposed, aiming at solving the problem of the vertical connection between the substrate of the contact image sensor and the circuit board of the light source

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