Joint apparatus and joint method
A bonding device and hot plate technology, which is applied in electrical components, presses, semiconductor/solid-state device manufacturing, etc., can solve the problems of reduced operating rate of stamping devices, increased operating costs of stamping devices, and shortened product life of sealing gaskets. The effect of preventing the reduction of the operation rate of the device
Active Publication Date: 2012-12-19
MURATA MFG CO LTD
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Problems solved by technology
[0007] However, since the gasket is exposed to high temperature, the product life of the gasket decreases due to the set temperature
Therefore, there is a problem that the gasket needs to be replaced frequently, and the operation rate of the press device is reduced.
In addition, there is also a problem that the running cost of the press device increases due to frequent replacement of gaskets.
Method used
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[0059] A bonding device and a bonding method according to a first embodiment of the present invention will be described with reference to the drawings.
[0060] (joint device)
[0061]The joining device will be described. The bonding device is a device for bonding substrates for bonding to each other by thermocompression bonding. The base material for bonding is the substrate before bonding, and includes not only the wafer and the assembly substrate, but also the sub-substrates that have been singulated. In the bonding apparatus of this embodiment, a plurality of bonding substrates are bonded together to manufacture a composite substrate. The bonding substrates used to manufacture the composite substrate may be different types of substrates or may be the same type of substrates. The manufactured composite substrate can be used as a component of an electronic device.
[0062] Such as figure 1 As shown, the engagement device 10 includes a housing 12 . Inside the casing 12,...
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A joint apparatus and a joint method can prevent a service life of a sealing part from reducing through a simple structure, thereby preventing a running rate of the apparatus from reducing. The joint apparatus (10) comprises a pressurization mechanism (14), a plurality of hot plate parts (26) disposed in a direction where the pressurization part (14) applies pressure and provided with heat sources inside, a frame body (30) disposed at the side of the hot plate parts (26), and a vacuum chamber (C) formed among the hot plate parts by laminating the hot plate parts which are close to one another in the pressure direction, wherein bonding base materials are joined through thermo-compression bonding by using the hot plate parts (26) in the vacuum chamber (C), and is characterized by comprising a sealing part (34) disposed between the hot plate parts (26) and the frame body (30) and sealing the vacuum chamber (C) in an air tight manner, and a frame body cooling part (38) disposed on the frame body (30) and used for cooling the frame body (30) and the sealing part (34).
Description
technical field [0001] The present invention relates to a bonding device and a bonding method for bonding plate-shaped or foil-shaped adhesive base materials, for example, by thermocompression bonding. Background technique [0002] At present, a press device has been proposed in which the cylinder for combining the upper and lower jigs and the cylinder for performing predetermined press processing in the compartment are made of different members, and the upper and lower jigs are connected by butt joints, that is, horizontal plane joints. Combination, by evacuating the compartment formed by the combination of the upper and lower jigs, and lowering the upper jig and the lower jig close to it under a high vacuum, a predetermined stamping process is performed (refer to Patent Document 1 ). [0003] According to the above punching device, it is possible to easily set a high vacuum in the compartment formed by the combination of the upper and lower jigs, and even if the sealing g...
Claims
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IPC IPC(8): H01L21/603
CPCB30B15/064B30B15/166B30B15/34Y10S100/00
Inventor 和田周平中岛航山根茂树
Owner MURATA MFG CO LTD