Automatic pipe layout mechanism for receiving pipes of integrated circuits

An integrated circuit and material receiving pipe technology, applied in the field of automatic pipe discharging mechanism, can solve the problems of shutdown, low discharge accuracy, high labor intensity, etc., and achieve the effect of smooth process flow, avoiding equipment accidents, and improving pipe discharging efficiency.

Active Publication Date: 2012-12-19
苏州均华精密机械有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, 15-20 tubes are manually placed into a group of magazines at a time, and then the operator continues to replenish the tubes in turn. The accuracy of the discharge is less than 70%. It is labor-intensive to rely on manual filling to adjust the direction. Big
There is also a turntable mechanism that takes out the receiving tube. When it is found that the receiving tube in the non-required direction is received, it is manually removed to ensure the correctness of the discharge direction of the receiving tube sent to the tube positioning mechanism. The random factor of this method Large, when there are too many empty tubes, it will immediately affect the smooth discharge of the machine, and shutdowns will occur, which restricts the improvement of production efficiency

Method used

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  • Automatic pipe layout mechanism for receiving pipes of integrated circuits
  • Automatic pipe layout mechanism for receiving pipes of integrated circuits
  • Automatic pipe layout mechanism for receiving pipes of integrated circuits

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0043] Embodiment: A kind of integrated circuit collecting tube automatic tube arrangement mechanism

[0044] See attached figure 1 ~ attached Figure 6 As shown, the automatic pipe arrangement mechanism is composed of a single pipe separation mechanism and a reversing mechanism, wherein:

[0045] The single-tube separation mechanism is composed of two single-tube separation wheels 1 with the same structure, each single-tube separation wheel 1 is fixedly arranged on a rotating shaft 2, and the rotating shaft 2 is arranged horizontally and is transmitted with a first rotating drive mechanism 3 Connected, the first rotary drive mechanism 3 drives the rotating shaft 2 to rotate 90 degrees each time, and the outer peripheral surface of each single-tube separation wheel 1 is provided with four single-tube grooves 4, and the single-tube groove 4 on each single-tube separation wheel 1 The central line is parallel to the axial direction of the rotating shaft 2 , and at least one det...

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Abstract

The invention discloses an automatic pipe layout mechanism for receiving pipes of integrated circuits. The automatic pipe layout mechanism is characterized by consisting of a single pipe separation mechanism and a reversing mechanism, wherein the single pipe separation mechanism comprises at least two single pipe separation wheels in the same structure, at least one single pipe groove is arranged on the peripheral surface of each of the single pipe separation wheels, and at least one detection unit for detecting the forward direction of the receiving pipes is arranged corresponding to the receiving pipes; and the reversing mechanism comprises at least one reversing wheel, a reversing groove is arranged on the reversing wheel in the radial direction correspondingly to the receiving pipes, and a stopper is arranged at the lowest position of the reversing wheel. According to the automatic pipe layout mechanism for the receiving pipes of the integrated circuits, the layout of the receiving pipes can be completely automated, the layout efficiency can be greatly increased, the human resources can be saved, and the accident of equipment and the damage on the integrated circuit product can be avoided, so that the whole process flow can be more smooth.

Description

technical field [0001] The invention relates to the discharge of material receiving pipes, in particular to an automatic pipe discharging mechanism for die-cutting shaped material receiving pipes in the integrated circuit packaging process. Background technique [0002] With the development of electronic technology. The work that must be combined with many large electronic circuits has been gradually replaced by integrated circuits. The volume of integrated circuits is thousands of times smaller than that of semiconductor structures made of discrete components, and the density is greatly increased, which is suitable for human use. When the chip and the lead frame carrying the chip are manufactured separately, the integrated circuit must go through processing steps such as bonding, baking, wire bonding, glue molding, and cutting before it can be used completely and without error. In the packaging and inspection operation of the post-integration circuit operation, the integra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677
Inventor 缪伟麟沈厚顺
Owner 苏州均华精密机械有限公司
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