Grinding method of workpiece
A workpiece and grinding technology, applied in the direction of grinding workpiece supports, metal processing equipment, grinding/polishing equipment, etc., can solve the problem of uneven thickness, the workpiece cannot be flattened, adhesive coating, etc. problem to prevent damage
Active Publication Date: 2016-04-27
DISCO CORP
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AI Technical Summary
Problems solved by technology
[0005] In the case of attaching a thin plate-shaped workpiece such as the above-mentioned wafer to a support substrate and grinding the workpiece, there is the following problem: the thickness of the support substrate and the adhesive layer realized by the adhesive Due to the uneven thickness of the workpiece, the workpiece after grinding cannot be flattened (uneven thickness)
Especially when the workpiece is large, it is difficult to apply the adhesive to a uniform thickness, so there is a tendency for the flatness of the workpiece after grinding to be worse
Method used
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no. 1 approach
[0038] First, a wafer (workpiece) to be back-ground by the grinding method of the first embodiment and a support substrate used in the grinding method will be described.
[0039] (1) Wafer
[0040] figure 1 (a) is a perspective view of a disc-shaped wafer 10 for back grinding and thinning by the grinding method of the first embodiment, figure 1 (b) is a sectional view of the wafer 10 . The wafer 10 is a substrate wafer for electronic equipment formed of a semiconductor material such as silicon or gallium arsenide with a uniform thickness, and the thickness of the wafer 10 is, for example, about 500 to 700 μm. Grid-like planned dividing lines 11 are set on the surface 10a of the wafer 10, and devices 12 having electronic circuits such as ICs and LSIs are formed in a large number of rectangular regions surrounded by the planned dividing lines 11.
[0041] (2) Support substrate
[0042] figure 2 (a) is a perspective view of the support substrate 20, figure 2 (b) is a side...
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The invention provides a method for grinding a to-be-processed object. When the to-be-processed object is grinded in a state of fitting on a support substrate, the precision of the flatness of the to-be-processed object after the grinding is higher than that in the prior art. A chip (the to-be-processed object) (10) is adhered on the support substrate (20) through adhesives (30), thereby forming the chip (1) adhered with the support substrate. Then an adhering sheet (40) is adhered on the support substrate, thereby forming the to-be-processed object unit (2). Then the chip is retained by a retaining face (52) of a retaining component (51) of a cutting device. Then the adhering sheet is cut by a turning processing component (55) of a cutting blade (58) rotating in a plane in parallel with the retaining face. Under the state, the thickness of the to-be-processed unit is uniform and the flatness is realized. Then the flat chip is obtained through grinding the chip. Then the adhering sheet is separated from the support substrate, thereby enabling the support substrate to be used repeatedly.
Description
technical field [0001] The present invention relates to a method of grinding a workpiece when thinning a thin-plate workpiece such as a device wafer while being bonded to a support substrate during the manufacture of a semiconductor device or an optical device. Background technique [0002] For example, in the manufacturing process of semiconductor equipment, grid-like planned dividing lines are set on the surface of a wafer made of semiconductor materials such as silicon or gallium arsenide, and a large number of rectangular shaped regions surrounded by the planned dividing lines are formed. Devices with electronic circuits such as IC (Integrated Circuit: Integrated Circuit) or LSI (LargeScale Integrated Circuit: Large Scale Integrated Circuit). Next, the wafer is cut along planned dividing lines after going through predetermined steps such as grinding the back surface to thin it to a predetermined thickness, thereby being divided into a large number of chip-shaped devices....
Claims
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IPC IPC(8): B24B37/27B24B37/04H01L21/304
CPCB24B7/228B24B41/061
Inventor 杉谷哲一
Owner DISCO CORP