A Method for Improving the Measurement Accuracy and Sensitivity of Thermal Sensitive Elements Built in Integrated Circuits
A technology of thermal elements and integrated circuits, which can be used in measuring devices, measuring heat, thermometers, etc., and can solve the problems of low precision and sensitivity of chip temperature measurement.
Inactive Publication Date: 2015-10-28
SUZHOU UNIV OF SCI & TECH
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[0006] The purpose of the present invention is to provide a method for improving the measurement accuracy and sensitivity of integrated circuit built-in thermosensitive elements, which solves the problem of low measurement accuracy and sensitivity of chip temperature in the prior art
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Embodiment 1
[0017] The temperature field formed by the actual heat conduction movement in the integrated circuit chip has the characteristics of uniform distribution (that is, concentric circles) in the area close to the hot spot, and the non-uniform distribution in the area far from the hot spot. In other words, even though the actual temperature field formed by the actual non-uniform heat conduction is generally irregular in shape, the temperature field within a certain short distance is still closer to concentric circular symmetry than the temperature field at a distance. combine figure 1 The temperature field near an actual hot spot of a certain integrated circuit chip, and according to the simulation results of the steady-state temperature field under a certain constant load, the actual measurement results of the steady-state temperature field under a certain constant load and other forms of on-chip It can be seen from the temperature distribution that there is a closed isotherm that...
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The invention discloses a method for improving measuring precision and sensitivity of a built-in thermo-sensitive element of an integrated circuit. The method comprises the steps as follows: distributing multiple temperature sensitive elements on a special iso-temperature line according to the temperature gradients and the iso-temperature lines of a heat source and a hot point inside the chip and temperature fields of the heat source and the hot point, so as to obtain multiple actual-measured temperature values through measurement; and performing data processing for the actual-measured values, so as to improve the measuring precision and sensitivity of a built-in thermo-sensitive element group of a chip. According to the method disclosed by the invention, the sum of the arithmetic mean value of the sum of the measuring values of all the thermo-sensitive elements which are uniformly and symmetrically distributed on the iso-temperature line with the maximum gradient of the hot point in the temperature field in the chip of the integrated circuit and a certain constant is adopted for carrying out the data processing method for removing deviation, thus, the maximum sensitivity and the minimum error with respect to the obtained temperature value can be realized.
Description
technical field [0001] The invention relates to the field of integrated circuits, in particular to a method for improving the measurement accuracy and sensitivity of a thermal sensor built in an integrated circuit. Background technique [0002] The number of transistors in an integrated circuit chip increases according to Moore's Law, and its operating clock frequency is also increasing rapidly, but its die area increases very slowly. As a result, the power consumption density of the chip increases sharply, and the temperature of the chip rises sharply, which poses a great threat to the reliability of the chip. In order to improve the reliability of integrated circuit chips and electronic systems, one of the first prerequisites is to improve the sensitivity and accuracy of on-chip temperature measurement. [0003] A practical approach in the existing chip design technology is to arrange four heat-sensitive elements roughly evenly around the heat source and add a fifth therm...
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IPC IPC(8): G01K1/14
Inventor 王俭刘传洋胡伏原
Owner SUZHOU UNIV OF SCI & TECH