Surface-mounted type LED (light-emitting diode) bracket, surface-mounted type LED and manufacture methods thereof

A technology of LED bracket and patch type, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of multiple costs, achieve the effects of reducing production costs, ensuring flatness, and increasing the range of dispensing volume

Active Publication Date: 2015-07-08
LEDMAN OPTOELECTRONIC HZ CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] To solve this problem, it can be solved by purchasing more accurate equipment, choosing a well-bonded glue, or changing the structure of the bracket, but more accurate equipment, glue with better performance, and brackets require more cost

Method used

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  • Surface-mounted type LED (light-emitting diode) bracket, surface-mounted type LED and manufacture methods thereof
  • Surface-mounted type LED (light-emitting diode) bracket, surface-mounted type LED and manufacture methods thereof
  • Surface-mounted type LED (light-emitting diode) bracket, surface-mounted type LED and manufacture methods thereof

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Embodiment approach

[0040] refer to Figure 5 , Figure 5 It is a flow chart of the embodiment of the manufacturing method of the patch type LED bracket of the present invention. The embodiment of the present invention comprises the following steps:

[0041] Step S1, preparing materials for positive metal substrate and negative metal substrate.

[0042] The preparation material can be silver, copper, aluminum or other alloy materials. Generally, copper material is selected as the preparation material, because copper has good electrical and thermal conductivity, and the price is reasonable.

[0043] Step S2, stamping the prepared materials of the positive metal substrate and the negative metal substrate into the positive metal substrate and the negative metal substrate respectively.

[0044] Usually, the positive metal substrate is connected to the anode of the power supply, and the negative metal substrate is connected to the cathode of the power supply.

[0045] Step S3, forming a plastic b...

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PUM

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Abstract

The invention discloses a surface-mounted type LED (light-emitting diode) bracket, a surface-mounted type LED and manufacture methods of the surface-mounted type LED (light-emitting diode) bracket and the surface-mounted type LED. The surface-mounted type LED bracket comprises an anode metal substrate, a cathode metal substrate, and a plastic body which partially covers the anode metal substrate and the cathode metal substrate; the plastic body is arranged on the upper lateral surfaces of the anode metal substrate and the cathode metal substrate to form a bowl cup; an anti-overflow step is arranged at the position at the top part of the bowl cup and adjacent to the lateral wall of the bowl cup; the anti-overflow step at least comprises a first height part and a second height part, which are not equal in height; the first height part is higher than the top part of the bowl cup; the second height part is higher than or as high as the top part of the bowl cup, and the first height part and the second height part form a step surface of the anti-overflow step in the direction adjacent to the lateral wall of the bowl cup. By this mode, the surface-mounted type LED bracket can effectively prevent the plastic body from overflowing during dispensing, and the production cost is lowered by reducing the demand on the dispensing accuracy.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to a patch-type LED bracket, a patch-type LED and a manufacturing method thereof. Background technique [0002] Such as figure 1 As shown, the existing SMD LED (Light Emitting Diode, Light Emitting Diode) bracket includes an anode metal substrate 1 , a cathode metal substrate 2 and a plastic body 3 . The plastic body 3 forms a cup 4 partially covering the LED chips on the positive metal substrate 1 and the negative metal substrate 2 . [0003] In the process of forming the LED, it is necessary to carry out a dispensing process on the bowl cup 4, but due to the different fluidity of the glue, it is difficult to control the amount of glue dispensing, and bubbles, excess glue, lack of glue or black spots etc. Among them, a large dispensing amount will reduce the light emitting angle and increase brightness, while a small dispensing amount will increase the light emitting angle...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/54
Inventor 李漫铁屠孟龙谢玲谢振胜
Owner LEDMAN OPTOELECTRONIC HZ CO LTD
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