Semiconductor package substrate

Abstract

Disclosed herein is a semiconductor package substrate including a base substrate, a mounting member mounted on an upper portion of the base substrate, and an adhesive layer formed between the base substrate and the mounting member, wherein the adhesive layer includes a thermally conductive adhesive and a ductile adhesive formed at the outer circumference of the thermally conductive adhesive.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to Korean Patent Application No. 10-2011-0079672, filed Aug. 10, 2011, entitled "Semiconductor Package Substrate," the entire contents of which are incorporated herein by reference. refer to. technical field [0003] The invention relates to a semiconductor package substrate. Background technique [0004] As household appliances such as refrigerators, washing machines, and air conditioners become more and more popular, the demand for various types of semiconductor device modules included in household appliances also increases. For example, an inverter board is one of semiconductor device modules included in home appliances. The power module used in the high-voltage board is the core component for controlling the power supply or driving the motor, and in the inverter board, the power module controls the motor power for controlling the driving of the motor. The power module is a high v...

AI Technical Summary

Problems solved by technology

However, during the semiconductor packaging process of mounting a chip and testing the reliability of the chip, when the semiconductor package is exposed to high temperature, interlayer cracks may be generated in the semiconductor package substrate, and due to the layers and chips constituting the semiconductor package substrate The difference in thermal expansion coefficient between, which may cause warping of the semiconductor package substrate

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