3results about How to "Avoid internal cracks" patented technology

The utility model relates to the technical field of dies, in particular to a forming die of an oxide ceramic product, which comprises a base, a die mechanism is arranged on the base and used for forming the oxide ceramic product, the die mechanism comprises a lower die, an upper die and a lower die, the lower die comprises a lower die holder fixed at the top of the base, and an inner cavity is arranged at the upper end in the lower die holder; four straight grooves distributed circumferentially are formed in the lower end of the interior of the inner cavity, sliding blocks are slidably installed in the straight grooves, a shaping plate is fixed to the upper ends of the sliding blocks, a circular plate is rotatably installed at the lower end of the interior of the lower die base, four arc grooves distributed circumferentially are formed in the outer edge of the upper end of the circular plate, cams are rotatably installed at the lower ends of the sliding blocks, and the cams are located in the arc grooves; a driving piece is mounted on the lower die holder and is used for driving the circular plate to rotate; the upper mold is arranged above the lower mold and is used for compacting the filler in the lower mold; the outer wall of the product and the shaping plate are free of contact friction during demolding, internal damage is avoided, it is guaranteed that no hidden defect exists after sintering, and the quality and yield of finished products are remarkably improved.

This application relates to a stacked interlocking semiconductor packaging structure, comprising: a substrate, a base plate, two chips, a packaging layer, and a protective shell; the substrate is disposed on the top surface of the base plate, and two chips are disposed on the substrate, with the packaging layer encapsulating the chips and the substrate; the protective shell is disposed on the top surface of the base plate and surrounds the sidewalls of the packaging layer; the protective shell includes: two or more stacked rings, each ring having a limiting groove on its inner sidewall, and the packaging layer having multiple limiting protrusions on its sidewalls, the limiting protrusions matching the limiting grooves for embedding within the limiting grooves. The protective shell surrounding the packaging layer effectively isolates and protects the packaging layer, preventing damage caused by direct exposure of the packaging layer's sidewalls to the outside. This application utilizes a stacked, interlocking ring structure to reliably complete the packaging process of microelectronic components or semiconductor devices; the overall structure is simple and easy to manufacture; it has significant advantages in terms of process speed and cost.

The present application belongs to the technical field of food baking, and provides a mousse cake layering forming method, comprising: activating the upper surface of the Nth layer of mousse layer which has been solidified, removing the surface condensate frost and forming micro roughness; adjusting the temperature of the N+1th layer of mousse paste to be filled to be within ±3℃ of the surface temperature of the Nth layer of mousse layer; using a low shear force mode, filling the N+1th layer of mousse paste after temperature adjustment into the Nth layer of mousse layer along the inner wall of the mold or through a flow guide device to obtain a multi-layer mousse assembly; precooling the multi-layer mousse assembly at 4-8℃ for 10-20min, and then freezing and shaping at 18-25℃.