Packaging device for compact single-phase integrated drive circuit and single-phase integrated drive circuit

A technology of integrated driving and packaging devices, which is applied in the direction of circuits, excitation or armature current control, electrical components, etc., can solve the problems of insufficient center distance of pins, reduction of center distance of pins, and difficulty in installation, etc., so as to reduce the overall cost, The effect of volume reduction and simple design
CN102931182BActive Publication Date: 2015-09-23HANGZHOU SILAN MICROELECTRONICS
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
HANGZHOU SILAN MICROELECTRONICS
Publication Date
2015-09-23

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Abstract

The invention provides a packaging device of a compact single-phase integrated drive circuit. The packaging device comprises wire-leading frame, a plurality of first chip paddles formed on the wire-leading frame, first grid electrode drive devices, second grid electrode drive devices, first upper arm transistors, first lower arm transistors, second upper arm transistors, second lower arm transistors, signal pins, and power pins, wherein each first grid electrode drive device, each second grid electrode drive device, each first upper arm transistor, each first lower arm transistor, each second upper arm transistor, and each second lower arm transistor are arranged on each first chip paddle, and each signal pin and each power pin are led from each first chip paddle and arranged oppositely on tow sides of the wire-leading frame. The invention further provides the single-phase integrated drive circuit, aims at solving the problems that drive circuit devices formed by discrete components are difficult in installation and poor in reliability due to large amount, and is particularly suitable for solving the problems that center distances of the pins are reduced due to the fact that packaging size is limited in integrated drive circuits, and thereof the pins are damaged with one another due to the fact that the center distances are not enough.
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Description

technical field

[0001] The invention belongs to the technical field of integrated semiconductors, in particular to a packaging device for a compact single-phase integrated drive circuit and the single-phase integrated drive circuit. Background technique

[0002] Compared with AC motors, brushless DC motors can effectively improve work efficiency, and can flexibly set the parameters of motor startup and shutdown through the adjustment of the control program, which can better meet the needs of users, and has increasingly become the first choice for household and industrial control motors.

[0003] Among brushless DC motors, there are three-phase brushless DC motors and single-phase brushless DC motors. Due to the large size of the current integrated drive circuit of the three-phase brushless DC motor, it is difficult to install it on the annular PCB (printed circuit board) inside many motors (such as motors with an outer diameter of 80mm and a shaft diameter of 34mm or less). ...

Claims

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