Packaging device for compact single-phase integrated drive circuit and single-phase integrated drive circuit

A technology of integrated driving and packaging devices, which is applied in the direction of circuits, excitation or armature current control, electrical components, etc., can solve the problems of insufficient center distance of pins, reduction of center distance of pins, and difficulty in installation, etc., so as to reduce the overall cost, The effect of volume reduction and simple design

Active Publication Date: 2015-09-23
HANGZHOU SILAN MICROELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] The object of the present invention is to provide a compact single-phase integrated drive circuit packaging device and a single-phase integrated drive circuit to solve the problems of difficult installation and poor reliability caused by the large number of components in the drive circuit formed by connecting discrete components , especially used to solve the problem of mutual damage between the pins due to insufficient center distance caused by the reduction of the center-to-center distance of the pins due to the limited package volume in the integrated drive circuit

Method used

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  • Packaging device for compact single-phase integrated drive circuit and single-phase integrated drive circuit
  • Packaging device for compact single-phase integrated drive circuit and single-phase integrated drive circuit
  • Packaging device for compact single-phase integrated drive circuit and single-phase integrated drive circuit

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] The present invention proposes a packaging device for a compact single-phase integrated drive circuit, such as Figure 4 As shown, the packaging device 100 of the compact single-phase integrated driving circuit includes a lead frame 102 on which a plurality of first chip base islands are formed. The plurality of first chip base islands include a first gate drive chip base island 104, a second gate drive chip base island 106, a first upper arm chip base island 108, a first lower arm chip base island 110, a second upper arm chip base island 110, and a second upper arm chip base island 108. chip base island 112 and the second lower arm chip base island 114 . Wherein, the first gate driver chip base island 104 and the second gate driver chip base island 106 are formed on an inner side of the lead frame, and the first upper arm chip base island 108 and the first lower arm chip base island 110. The second upper arm chip base island 112 and the second lower arm chip base isla...

Embodiment 2

[0093] On the basis of embodiment one, see Figure 9 , and combined with Figure 10 and Figure 11 , the packaging device of the compact single-phase integrated drive circuit further includes: a first bootstrap diode pad 69 and a second bootstrap diode pad 59, the first bootstrap diode pad 69 is formed on the On the first gate driver 104 , the second bootstrap diode pad 59 is formed on the second gate driver 106 .

[0094] The packaging device of the compact single-phase integrated drive circuit further includes a first bootstrap diode chip base island and a second bootstrap diode chip base island, the first bootstrap diode chip base island is formed on the lead frame, And close to the first gate driver chip base island, the second bootstrap diode chip base island is formed on the lead frame and close to the second gate drive chip base island.

[0095] The packaging device of the compact single-phase integrated drive circuit also includes a first bootstrap diode chip 80 and...

Embodiment 3

[0101] On the basis of Embodiment 1 or Embodiment 2, the packaging device 100 of the compact single-phase integrated drive circuit further includes: a plurality of second chip base islands formed on the lead frame 102, and mounted on each Each of the switch units on the second chip base island is formed by connecting an upper arm switch unit and a lower arm switch unit in end-to-end series.

[0102] Preferably, each of the upper arm switch units includes an on resistor RG_ON, and each of the lower arm switch units includes an off resistor RG_OFF.

[0103] The start end, the middle end and the end end of one of the end-to-end series switch units respectively receive the first upper arm bias voltage VB1, the first upper arm drive signal HO1 and the first upper arm bias voltage ground VS1; the other end-to-end The start end, the middle end and the end end of the switch units connected in series respectively receive the first gate drive bias voltage VCC1, the first lower arm drive...

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Abstract

The invention provides a packaging device of a compact single-phase integrated drive circuit. The packaging device comprises wire-leading frame, a plurality of first chip paddles formed on the wire-leading frame, first grid electrode drive devices, second grid electrode drive devices, first upper arm transistors, first lower arm transistors, second upper arm transistors, second lower arm transistors, signal pins, and power pins, wherein each first grid electrode drive device, each second grid electrode drive device, each first upper arm transistor, each first lower arm transistor, each second upper arm transistor, and each second lower arm transistor are arranged on each first chip paddle, and each signal pin and each power pin are led from each first chip paddle and arranged oppositely on tow sides of the wire-leading frame. The invention further provides the single-phase integrated drive circuit, aims at solving the problems that drive circuit devices formed by discrete components are difficult in installation and poor in reliability due to large amount, and is particularly suitable for solving the problems that center distances of the pins are reduced due to the fact that packaging size is limited in integrated drive circuits, and thereof the pins are damaged with one another due to the fact that the center distances are not enough.

Description

technical field [0001] The invention belongs to the technical field of integrated semiconductors, in particular to a packaging device for a compact single-phase integrated drive circuit and the single-phase integrated drive circuit. Background technique [0002] Compared with AC motors, brushless DC motors can effectively improve work efficiency, and can flexibly set the parameters of motor startup and shutdown through the adjustment of the control program, which can better meet the needs of users, and has increasingly become the first choice for household and industrial control motors. [0003] Among brushless DC motors, there are three-phase brushless DC motors and single-phase brushless DC motors. Due to the large size of the current integrated drive circuit of the three-phase brushless DC motor, it is difficult to install it on the annular PCB (printed circuit board) inside many motors (such as motors with an outer diameter of 80mm and a shaft diameter of 34mm or less). ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/16H01L23/31H01L23/495H02P7/28
CPCH01L2224/48247H01L2224/49171H01L2224/48257H01L2924/13091H01L2924/1305H01L2224/48137H01L2924/00
Inventor 吴美飞
Owner HANGZHOU SILAN MICROELECTRONICS
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