Low-insertion-loss coupling technique

A process method and chip technology, applied in the coupling of optical waveguides, etc., can solve the problems of hidden reliability, high price, and the accuracy of automatic search software cannot reach 100%, so as to avoid excessive loss and reduce production costs. Effect

Inactive Publication Date: 2013-02-27
镇江华坚电子有限公司
1 Cites 12 Cited by

AI-Extracted Technical Summary

Problems solved by technology

Its working principle is to determine the coupling curing position by searching the maximum value of optical power by the automatic search software during the coupling process. There are some problems in this process method: first, an automatic coupling system is expensive, which is about 10 times that of a manual coupli...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Abstract

The invention relates to a planar lightwave circuit splitter, in particular to a technique for coupling a planar lightwave circuit splitter chip and fiber array and provides a low-insertion-loss coupling technique. The low-insertion-loss coupling technique comprises an input single fiber (1), the planar lightwave circuit splitter chip (2) and an output optical fiber array (3). The low-insertion-loss coupling technique is characterized in that the input single fiber (1), the planar lightwave circuit splitter chip (2) and the output optical fiber array (3) are integrated. Difference between a chip insertion loss standard value and a finished product insertion loss value is reduced to the largest extent, phenomena of large loss and unstable performance of an automatic monitoring system caused by errors are avoided, and simultaneously production cost is reduced.

Application Domain

Technology Topic

PhysicsFiber array +5

Image

  • Low-insertion-loss coupling technique

Examples

  • Experimental program(1)

Example Embodiment

[0019] Example 1:
[0020] Such as figure 1 Shown:
[0021] Put the cleaned input single fiber 1 and planar waveguide chip 2 together with the fixtures on the six-dimensional adjustment frame in turn, find the two sides of the input single fiber 1 and planar waveguide chip 2 with the help of a microscope observation system, first adjust the X axis to be parallel, and then Adjust the two lines on the Y axis to be parallel.
[0022] Turn on the light source, aim the infrared light at the end faces of the input single fiber 1 and the planar waveguide chip 2, hereinafter referred to as the coupling point, adjust the two light points refracted by the two end faces by adjusting the knob to overlap, and then adjust the chip output end on the right side Place the mirror at the position to observe the corresponding channel light spot reflected by the channel at the output end of the chip, and find the brightest light spot by adjusting the X and Y axis coarse adjustment knobs.
[0023] Install the output fiber array 3 into the output end fixture of the six-dimensional adjustment frame. This step is the same as the input single fiber 1 debugging, that is, repeat step 2.
[0024] After the optical fiber array 3 at the output end and the planar waveguide chip 2 are adjusted to be parallel, the coupling surfaces at both ends are separated by a few millimeters, and then the output end coarse adjustment knob is adjusted first, and then the input end coarse adjustment knob is adjusted to adjust the index to the chip mark When the weighing value is about 2-3 times, the output fiber array 3 and the input single fiber 1 are gradually pushed closer to the planar waveguide chip 2 according to the output end first and then the input end. When the index is adjusted to less than 2 times the nominal value of the chip, start to use the fine-tuning knob, and gradually push it in three or several times, and adjust it after each push until the index is adjusted to about the nominal value.
[0025] Step back the input single fiber 1 and output fiber array 3 on both sides of the planar waveguide chip 2 by 1 mm, and start to dispense UV glue, and then complete the subsequent operations after curing, until the packaging is completed.
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

no PUM

Description & Claims & Application Information

We can also present the details of the Description, Claims and Application information to help users get a comprehensive understanding of the technical details of the patent, such as background art, summary of invention, brief description of drawings, description of embodiments, and other original content. On the other hand, users can also determine the specific scope of protection of the technology through the list of claims; as well as understand the changes in the life cycle of the technology with the presentation of the patent timeline. Login to view more.
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Similar technology patents

Auto insurance claim safety protection system

ActiveCN109361652AAvoid excessive lossAvoid Data Corruption or LeakageFinanceTransmissionSystem serviceSystem recovery
Owner:BEIJING JINGYOU CENTURY SOFTWARE TECH

Classification and recommendation of technical efficacy words

  • Reduce manufacturing cost
  • Avoid excessive loss
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products