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SFP packaging module

A technology for encapsulating modules and sliders, which is applied in the field of optoelectronic communication, can solve the problems of poor size consistency of SFP encapsulating modules, relatively large impact on the reliability of the whole machine, and high manufacturing costs, and achieve simple structure, improved dimensional stability, and reduced The effect of production costs

Active Publication Date: 2013-02-27
无锡市恒英盛电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] (1) Environmental pollution issues
Due to the use of zinc alloy die-casting, electroplating must be used, and the pollution of electroplating to the environment is relatively serious
[0005] (2) The problem of dimensional stability
The size consistency of the SFP package module is not good
[0006] (3) High manufacturing cost
At present, the yield of SFP packaging modules from die-casting to final assembly is relatively low, about 85%, so the manufacturing cost is relatively high
[0007] (4) The reliability of the whole machine is greatly affected by the SFP package module

Method used

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Examples

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Embodiment Construction

[0028] Below the present invention will be further described in conjunction with the embodiment in the accompanying drawing:

[0029] Such as Figure 1~7 As shown, the present invention mainly includes an upper cover 1 , an unlocking ring 2 , an LC connector 3 , a block 4 , an unlocking slider 5 , a base 6 and an unlocking compression spring 7 .

[0030] The base 6 includes a connection base 6-1 and a base cavity base 6-2, and the two bases 6-1 are connected to the front end of the base cavity base 6-2, and the two bases 6-1 are connected to the base cavity base 6-2 The place is step bending 6-3. The two bases 6-1 are symmetrically distributed left and right. The two bases 6-1 are provided with upper cover fixing sockets 6-4, and the upper ends of the two bases 6-1 are provided with fixed bending 6-5. The front ends of the two bases 6-1 are provided with LC connector boards 6-6. Two base fixed sockets 6-7 are symmetrically arranged on the base chamber seat 6-2, and two cir...

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Abstract

The invention relates to an SFP packaging module, and belongs to the technical field of photoelectric communication. The SFP packaging module comprises an upper cover, an unlocking pull ring, an LC connector, a baffle block, an unlocking sliding block, a base and an unlocking pressure spring; the LC connector is installed in the base; an LC connector plug board is plugged into a base connecting bayonet; and a base connecting clamping groove is embedded into a fixing bending part. The upper cover is installed on the base; an upper cover elastic piece is positioned between the base and an upper cover connecting clamping groove; and a locking clamping block is embedded in an upper cover fixing embedding opening. A connecting clamping block is embedded in a base fixing embedding opening, and a base clamping block is embedded in a bayonet. The SFP packaging module has a simple, compact and reasonable structure, avoids die casting and electroplating processes, adopts pressing and injection processes, reduces the production cost, reduces the environment protection, improves the dimensional stability and the corrosion resistance of products, and improves the assembly efficiency through a buckling design.

Description

technical field [0001] The invention relates to an SFP packaging module, which belongs to the technical field of photoelectric communication. Background technique [0002] SFP (Small Form-factor Pluggables) is a miniaturized, hot-swappable optical transceiver module. Its basic function is to realize photoelectric signal conversion in signal transmission. Due to its small size, simple structure, and hot-swappable features, the SFP package module has great advantages in the maintenance and upgrade of communication systems. Therefore, many types of optical module products tend to use SFP package modules. [0003] Since the market demand for such products is quite large, there are relatively high requirements for product reliability and manufacturing costs. At present, the SFP packaging modules commonly used at home and abroad are in the form of zinc alloy die-casting base and sheet metal upper cover. This structure can meet the relevant requirements of the MSA protocol, and...

Claims

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Application Information

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IPC IPC(8): G02B6/42
Inventor 曹洪龙
Owner 无锡市恒英盛电子科技有限公司
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