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Local-fitting hole-avoiding flex-rigid combined board and manufacturing method thereof

A rigid-flex combined board and partial technology, applied in the direction of multi-layer circuit manufacturing, printed circuit components, etc., can solve the problems of layered board explosion, product test open circuit and poor reliability of products, so as to improve the bonding force, avoid board explosion and Layering, avoiding the effect of large differences in material properties

Inactive Publication Date: 2015-04-22
SHENZHEN SUNTAK MULTILAYER PCB
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] For this reason, the purpose of the present invention is to provide a rigid-flex board and its manufacturing method that are partially bonded and avoid holes, so as to solve the problems of delamination explosion, product test open circuit and poor product reliability in the current rigid-flex board manufacturing process. problems, realize the simple and controllable manufacturing process of rigid-flex boards, and improve the reliability of products

Method used

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  • Local-fitting hole-avoiding flex-rigid combined board and manufacturing method thereof
  • Local-fitting hole-avoiding flex-rigid combined board and manufacturing method thereof
  • Local-fitting hole-avoiding flex-rigid combined board and manufacturing method thereof

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Embodiment Construction

[0034] In order to illustrate the idea and purpose of the present invention, the present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0035] In the present invention, the cover film, pure glue and heat-conducting double-sided adhesive are made into a shape slightly larger than that of the window, and the partial area of ​​the window is bonded, and the other areas are pressed by the non-flowing prepreg, which improves the inter-board contact. Bonding force; at the same time, a through hole corresponding to the pressing position of the hard board is opened on the cover film, which prevents the residual glue from entering the blind hole, through hole or slot hole of the hard board, and ensures the rigid-flexible combination The electrical conduction performance of the board improves the reliability of the product.

[0036] See image 3 , Figure 4 as shown, image 3 It is a schematic cross-sectional structu...

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Abstract

The invention discloses a local-fitting hole-avoiding flex-rigid combined board and a manufacturing method thereof. The manufacturing method comprises the following steps: S1, manufacturing a soft board; S2, windowing a hard board and a no-flow prepreg, corresponding a hard board window to a no-flow prepreg window in position and ensuring equal sizes of the two windows; S3, manufacturing a covering film, correspondingly fitting the covering film onto the soft board, adhering the no-flow prepreg on the covering film, and correspondingly positioning the covering film under the windowing position of the no-flow prepreg; and S4, laminating the hard board on the covering film to form the flex-rigid combined board. By the method, the bonding capability of the soft board and the hard board is improved, board cracking and layering are avoided, and the electrical conducting property of holes in a product is ensured; the manufacturing technology of the flex-rigid combined board is simple, convenient and controllable; and the reliability of the product is improved.

Description

Technical field: [0001] The invention belongs to the technical field of circuit board production, and in particular relates to a rigid-flex board with partial bonding and avoiding holes and a production method thereof. Background technique: [0002] With the development of electronic products in the direction of high density, miniaturization, and high reliability, rigid-flexible printed circuit boards are especially suitable for today's electronic products for light, Requirements for thin, short, and small features. [0003] The rigid-flex board is a combination of a soft board and a hard board. The thin-layered flexible bottom layer and the rigid bottom layer are combined, and then laminated into a single component to form a circuit board. It has both a rigid layer and a flexible layer. It is a multilayer printed circuit board. In the PCB industry, the rigid-flex board is a type of printed board that has grown very rapidly in recent years, with a fast growth rate and a wi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K3/46
Inventor 邓先友彭卫红刘东何淼田晴
Owner SHENZHEN SUNTAK MULTILAYER PCB
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