Rotating cathode for vacuum magnetron sputtering coating

Abstract

The invention provides a rotating cathode for vacuum magnetron sputtering coating. The rotating cathode comprises an insulating seat, a cathode mounting seat, a vacuum substrate, a mounting seat and a water joint. The insulating seat is fixedly installed on the vacuum substrate; the cathode mounting seat and the mounting seat are fixedly arranged on the insulating seat; the cathode mounting seat and the mounting seat are respectively in seal connection with two ends of a target material through a rotary cathode end cover and a second cathode end cover; the insulating seat is provided with a transmission shaft; a driving gear at the upper end of the driving shaft engages with a driven gear fixed on the cathode end cover; a central pipe, which does not rotate, is arranged in the target material; the top of the central pipe is provided with a magnetic core element; the central pipe is connected with the water joint through a water conduit; an inner hole of the central pipe communicates with a water inlet hole of the water joint through the water inlet pipe; and the target material, the cathode end cover, the second cathode end cover, the water conduit and the water joint form a sealed cavity. The invention improves utilization rate of the target material and uniformity of coating, and has the advantages of good sealing effect, low repair cost and long service life.

Description

technical field [0001] The invention relates to a coating sputtering device, in particular to a rotating cathode for vacuum magnetron sputtering coating. Background technique [0002] Vacuum magnetron sputtering coating is the best coating quality and the most widely used coating deposition process in the field of large-area thin film deposition. In the magnetron sputtering coating process, the quality requirements of magnetron sputtering coating equipment are very high. In the magnetron sputtering coating equipment, the magnetron sputtering cathode is particularly important. At present, planar magnetron sputtering cathodes or simple rotating cathodes are commonly used, but due to the shortcomings of planar cathode structure design, the utilization rate of cathode target deposition is very low (not more than 40%). And after a certain period of time, a racetrack-shaped sputtering area will be formed, which seriously affects the stability and uniformity of the coating in the ...

AI Technical Summary

Problems solved by technology

At present, planar magnetron sputtering cathodes or simple rotating cathodes are commonly used, but due to the shortcomings of planar cathode structure design, the utilization rate of cathode target deposition is very low (no more than 40%)

And after a certain period of time, a racetrack-shaped sputtering area will be formed, which seriously affects the stability and uniformity of the coating in the later stage. However, due to the immature technology of the simple rotating cathode, water leakage, air leakage and short circuit of the cathode often occur, which seriously affect the coating. The quality and service life of the equipment

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