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A bracket and a welding method for the bracket

A welding surface and soldering technology, applied in the field of manufacturing technology, can solve problems such as detaching from the PCB board and being unable to resist screw standoff

Active Publication Date: 2019-03-29
LENOVO (BEIJING) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] When the screw is usually locked on the standoff, a large level of torque is usually generated, so it often happens that the surface solder adhesion of the PCB board cannot resist the torque of the screw, resulting in the standoff being twisted off and detached from the PCB board.
The undesirable consequence of having to send the PCB back to the repair center for rework

Method used

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  • A bracket and a welding method for the bracket
  • A bracket and a welding method for the bracket
  • A bracket and a welding method for the bracket

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Embodiment Construction

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0035] The purpose of this method is to improve the surface shape of the standoff and make full use of the capillary effect when the solder paste is heated to a liquid state, so that the solder can not only generate surface welding force, but also produce vertical tin pillars to clamp the surface groove of the standoff. After the solder is cooled, a solder bond that resists horizontal torsion is produced.

[0036] see figure 2 , which is a schematic structural di...

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PUM

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Abstract

The invention discloses a standoff and a method for soldering the same. The standoff comprises a first portion and a second portion, wherein the first portion is an upright column of the standoff, the second portion is a fixing part of the standoff and is positioned at the lower end of the first portion, the first portion and the second portion are structurally integrated, at least one groove is processed on a first surface of the first portion, and the first surface is an outer surface, which is perpendicular to the horizontal plane, on the first portion. The standoff and the method have the advantages that the standoff is provided with the grooves, soldering tin can flow into the grooves of the upright column under the action of a capillary phenomenon caused after the soldering tin is heated, accordingly, the soldering area is increased to the greatest extent, the soldering reliability of the upright column is improved, and the horizontal torque resistance of the standoff after soldering is obviously improved.

Description

technical field [0001] The technical field of manufacturing process of the present invention, in particular, relates to a bracket and a welding method for the bracket. Background technique [0002] Usually, a support (Post standoff) needs to be provided on the motherboard to fix various devices, such as WIFI card, fan, hard disk support and so on. [0003] see figure 1 , which is a structural schematic diagram of an existing standoff. Usually, a standoff includes two parts: a column 100 and a fixing piece (such as a nut (NUT)) 200 . The fixing part 200 is used to fix the stantoff on the printed circuit board (PCB), and the column 100 is used to lock the screws to fix the components that need to be fixed. [0004] When the screw is usually locked on the standoff, a large level of torque is usually generated, so it often happens that the surface solder adhesion of the PCB board cannot resist the torque of the screw, resulting in the standoff being twisted off and detached f...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/18B23K1/00
Inventor 吴磊
Owner LENOVO (BEIJING) LTD