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Packaging and function tests for package-on-package and system-in-package structures

A technology for functional testing and packaging, which is used in semiconductor/solid-state device testing/measurement, electrical components, electrical solid-state devices, etc., and can solve problems such as intractability, low yield, and low productivity

Active Publication Date: 2013-03-20
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Smaller jigs are difficult to handle during the step of bonding the upper assembly stackup to multiple units
This results in lower productivity and possibly lower yield

Method used

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  • Packaging and function tests for package-on-package and system-in-package structures
  • Packaging and function tests for package-on-package and system-in-package structures
  • Packaging and function tests for package-on-package and system-in-package structures

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Embodiment Construction

[0029] The making and using of various embodiments of the invention are discussed in detail below. It should be appreciated, however, that the various embodiments provide many applicable inventive concepts that can be implemented in a wide variety of specific contexts. The specific embodiments discussed are illustrative only, and do not limit the scope of the invention.

[0030] Methods for packaging and implementing functional tests are provided according to various embodiments. Intermediate steps of forming the package and corresponding functional testing are shown. Variations of various embodiments are discussed. Throughout the drawings and described embodiments, the same reference numerals are used to designate the same elements

[0031] Figure 1A A top view of a packaging substrate strip 20 comprising a plurality of packaging substrates 22 is shown. Figure 1B A cross-sectional view of a portion of a package substrate strip 20 is shown, wherein the cross-sectional v...

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PUM

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Abstract

The invention provides packaging and function tests for package-on-package and system-in-package structures. A method includes placing a plurality of bottom units onto a jig, wherein the plurality of bottom units is not sawed apart and forms an integrated component. Each of the plurality of bottom units includes a package substrate and a die bonded to the package substrate. A plurality of upper component stacks is placed onto the plurality of bottom units, wherein solder balls are located between the plurality of upper component and the plurality of bottom units. A reflow is performed to join the plurality of upper component stacks with respective ones of the plurality of bottom units through the solder balls.

Description

technical field [0001] The present invention relates to an integrated circuit, and more specifically relates to packaging and functional testing of a package-on-package structure and a system-in-package structure. Background technique [0002] In the packaging of integrated circuits, the die may be packaged onto a packaging substrate (sometimes called a laminate substrate) that includes metal connections that may be between opposite sides of the laminate substrate Transmit (route) electrical signals. The die may be bonded to one side of the laminate substrate using flip chip bonding and reflow performed to melt the solder bumps interconnecting the die and the laminate substrate. Laminated substrates can be used in package-on-package and system-in-package structures. [0003] In a conventional packaging and testing process, a plurality of known good dies are singulated from a wafer, and the plurality of known good dies are first bonded to a packaging substrate strip compris...

Claims

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Application Information

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IPC IPC(8): H01L21/98H01L21/66H01L25/065
CPCH01L22/20H01L25/50H01L23/3128H01L2224/97H01L2924/15311H01L23/48H01L24/97H01L2924/15331H01L22/14H01L2224/73204H01L2224/16225H01L25/105H01L2224/32225H01L2224/73253H01L2225/1023H01L2225/1058H01L2224/81H01L2924/00012H01L2924/00
Inventor 刘浩君庄其达萧景文陈承先郭正铮陈志华
Owner TAIWAN SEMICON MFG CO LTD