Radio-frequency filter piece packaging structure

Abstract

The invention provides a radio-frequency filter piece packaging structure. An inductance machine of the structure is low in cost and small in occupied space, and inductance is easy to adjust. The radio-frequency filter piece packaging structure comprises a packaging base plate and one or a plurality of pipe cores, and further comprises a pipe core bonding zone which is arranged on the pipe core, a plurality of base plate bonding zones which are arranged on the packaging base plate, and a bonding line which connects the plurality of base plate bonding zones, and connects one or a plurality of the base plate bonding zones and each pipe core bonding zone on the one or the plurality of pipe cores.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to a package structure of a radio frequency filter device. Background technique [0002] Piezoelectric acoustic wave filter (hereinafter referred to as "filter") is a widely used filter device. In order to make the filter have a better filtering effect, it is necessary to have a strong suppression effect on unwanted input signals in specific frequency bands, and the filter usually has transmission zeros in these frequency bands. Transmission zero can be achieved by connecting inductors of different values ​​to the filter. There are two types of inductors commonly used in filters: [0003] 1. Surface mount inductors. figure 1 It is a schematic diagram of a chip package structure using surface mount inductors according to the prior art. Such as figure 1 As shown, the filter die 12 is connected to the inductor 13 mounted on the substrate 11 through bonding wires or sub...

AI Technical Summary

Problems solved by technology

Although the cost of this type of inductor is lower than that of surface mount inductors, there are also problems such as the inductance value is not easy to adjust, and the inductor takes up a lot of space.

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