Radio-frequency filter piece packaging structure

A technology of device packaging and radio frequency filtering, which is applied in the field of integrated circuits, can solve the problems of difficult adjustment of inductance value and large space occupied by inductors, and achieve the effect of low cost and cost saving

Inactive Publication Date: 2013-03-20
TIANJIN UNIV
View PDF6 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the cost of this type of inductor is lower than that of surface mount inductors, there are also problems such as the inductance value is not easy to adjust, and the inductor takes up a lot of space.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Radio-frequency filter piece packaging structure
  • Radio-frequency filter piece packaging structure
  • Radio-frequency filter piece packaging structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] Exemplary embodiments of the present invention are described below in conjunction with the accompanying drawings, which include various details of the embodiments of the present invention to facilitate understanding, and they should be regarded as exemplary only. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications of the embodiments described herein can be made without departing from the scope and spirit of the invention. Also, descriptions of well-known functions and constructions are omitted in the following description for clarity and conciseness.

[0028] image 3 is a schematic diagram of a chip package structure according to an embodiment of the present invention. As shown in the figure, a bonding area 301 is provided on the die 300 adhered to the surface of the packaging substrate 100 by an adhesive. For this type of packaging structure, in this embodiment, a plurality of substrate bonding areas are connected by...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a radio-frequency filter piece packaging structure. An inductance machine of the structure is low in cost and small in occupied space, and inductance is easy to adjust. The radio-frequency filter piece packaging structure comprises a packaging base plate and one or a plurality of pipe cores, and further comprises a pipe core bonding zone which is arranged on the pipe core, a plurality of base plate bonding zones which are arranged on the packaging base plate, and a bonding line which connects the plurality of base plate bonding zones, and connects one or a plurality of the base plate bonding zones and each pipe core bonding zone on the one or the plurality of pipe cores.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to a package structure of a radio frequency filter device. Background technique [0002] Piezoelectric acoustic wave filter (hereinafter referred to as "filter") is a widely used filter device. In order to make the filter have a better filtering effect, it is necessary to have a strong suppression effect on unwanted input signals in specific frequency bands, and the filter usually has transmission zeros in these frequency bands. Transmission zero can be achieved by connecting inductors of different values ​​to the filter. There are two types of inductors commonly used in filters: [0003] 1. Surface mount inductors. figure 1 It is a schematic diagram of a chip package structure using surface mount inductors according to the prior art. Such as figure 1 As shown, the filter die 12 is connected to the inductor 13 mounted on the substrate 11 through bonding wires or sub...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H03H9/46
CPCH01L2224/48227H01L2924/1902H01L2924/19107
Inventor 张浩周冲庞慰赵远
Owner TIANJIN UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap