Exposure device

Abstract

An exposure device that corrects the movement of the workpiece in a plane parallel to the workpiece surface due to the straightness of the Z-direction moving mechanism when the workpiece is moved in the Z direction perpendicular to the workpiece surface. The mask mark image of the mask is detected by a calibration microscope, and its position is stored. Next, the workpiece is placed on the suction table, the position of the workpiece mark is detected, the workpiece and the mask are aligned, and the distance from the slider to the mirror is stored by the laser length measuring instrument. Next, for exposure processing, the workpiece table is lowered by the thickness of the workpiece by the Z-direction moving mechanism, and the distance from the slider to the mirror is measured by a laser length measuring instrument. Then, the amount of movement due to the lowering of the workpiece table is detected based on the distance, and the workpiece is returned to the position aligned with the mask. In this state, exposure light is emitted from the light emitting portion to expose the workpiece.

Description

technical field [0001] The present invention relates to an exposure apparatus, and more specifically, to an exposure apparatus capable of reducing the amount of positional displacement on the table top of a mobile table that occurs when the mobile table is moved in a direction perpendicular to the table top. Background technique [0002] The exposure apparatus is used for pattern formation of wiring etc. in the manufacturing process of a printed circuit board, a liquid crystal panel, etc. (hereinafter also referred to as a workpiece). exist Figure 6 A configuration example of the above-mentioned exposure apparatus is shown in . [0003] Figure 6 The exposure apparatus shown is a projection exposure apparatus equipped with a projection lens for exposing a workpiece by projecting a pattern of a mask on the projection lens. The apparatus shown in this figure shows a projection exposure apparatus that forms The alignment mark is exposed by aligning the alignment mark (hereina...

AI Technical Summary

Problems solved by technology

[0028] (6) In the above, although the alignment of the mask M and the workpiece W is completed, and then shifts to the exposure process, however, exposure cannot be performed in this state

[0035] For this reason, as described above, when the movable stage 32 moves in the direction of the optical axis L of the projection lens 40 (Z holding) by the Z-direction moving mechanism 50, even the movable stage 32 holding the workpiece W due to the above-mentioned straightness (suction operation) stage 33) moves (offset) in the XYθ direction, and it is impossible to detect how far the mobile stage 32 has moved in the XYθ direction

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