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Non-contact experimental method for measuring heat constant of high-temperature material

An experimental method and technology of high-temperature materials, applied in the direction of thermal expansion coefficient of materials, using a stable bending force to test the strength of materials, etc., can solve the problems of high cost and cumbersome procedures, and achieve the effect of saving labor and simplifying operations

Inactive Publication Date: 2013-04-03
TSINGHUA UNIV
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Problems solved by technology

However, in the above-mentioned traditional test method, each parameter must be measured separately, and the temperature must be raised every time during high-temperature measurement, the process is cumbersome and the cost is relatively expensive.

Method used

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  • Non-contact experimental method for measuring heat constant of high-temperature material
  • Non-contact experimental method for measuring heat constant of high-temperature material
  • Non-contact experimental method for measuring heat constant of high-temperature material

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Embodiment Construction

[0019] The specific structure, working principle and working process of the present invention will be further described below in conjunction with the accompanying drawings, but the protection scope of the present invention should not be limited by this.

[0020] figure 1 It is a schematic diagram of the device of the present invention. The device includes a CCD1, a first LED blue light source 2, a second LED blue light source 3, a blue light filter 4, a three-point bending loading device and a sample 5, a high temperature box 6 and a transparent glass window 7; the first LED The blue light emitted by the blue light source 2 and the second LED blue light source 3 passes through the transparent glass window 7 and then irradiates the surface of the sample. The diffusely reflected light passes through the transparent glass window 7 and the blue light filter 4 in turn, and is received by the CCD1.

[0021] figure 2 It is a schematic diagram of the three-point bending loading dev...

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Abstract

The invention discloses a non-contact experimental method for measuring a heat constant of a high-temperature material, and belongs to the technical field of experimental mechanics and high-temperature test. An elastic modulus, a poisson ratio and a thermal expansion coefficient of the material under a high temperature are measured by combining a high-temperature digital speckle technology, a three-point bending technology and a virtual field technology. By the method, a charge coupled device (CCD) is used for recording speckle maps of a three-point bent test sample before and after thermal load; a full-field strain before and after the thermal load is calculated by a digital speckle method; the elastic modulus, the poisson ratio and the thermal expansion coefficient of the material under high temperature are calculated; and the elastic modulus, the poisson ratio and the thermal expansion coefficient of the material under high temperature can be measured at the same time.

Description

technical field [0001] The invention relates to a method for measuring elastic modulus, Poisson's ratio and thermal expansion coefficient of materials at high temperature by combining high-temperature digital speckle, three-point bending and virtual field technology, belonging to the technical fields of experimental mechanics and high-temperature testing. Background technique [0002] At present, the determination of the elastic modulus and Poisson's ratio of materials at high temperatures is mainly through high-temperature tensile tests. The samples are stretched at high temperatures, and the elastic modulus is obtained by recording the tensile load and measuring the strain in the tensile direction and transverse direction. quantity and Poisson's ratio. The coefficient of thermal expansion is mainly measured by recording the strain after heating. However, in the above-mentioned traditional test method, each parameter must be measured separately, and the temperature must be...

Claims

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Application Information

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IPC IPC(8): G01N3/20G01N25/16
Inventor 姚学锋马寅佶刘晓宇王栋方岱宁
Owner TSINGHUA UNIV
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