Treatment method for removing SixNy residue
A treatment method and residue technology, which is applied in the manufacture of electrical components, semiconductor/solid-state devices, circuits, etc., can solve the problems of pollution, residues on the surface of silicon wafers, and re-texturing, etc., to achieve simple process, silicon Chip performance is not affected, the effect of improving yield
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[0017] The present invention will be further illustrated below in conjunction with the accompanying drawings and specific embodiments. This embodiment is implemented on the premise of the technical solution of the present invention. It should be understood that these embodiments are only used to illustrate the present invention and are not intended to limit the scope of the present invention.
[0018] Such as figure 1 A treatment method for removing the SixNy residue shown, the specific steps are as follows:
[0019] (1) Sodium hydroxide with a mass percentage of 1.1% and H with a volume ratio of 3.3% 2 o 2 Water mixture, heated to 65°C;
[0020] (2) Soak the silicon wafer in the above solution for 3 minutes;
[0021] (3) Soak the soaked silicon wafer in water for 3.5 minutes;
[0022] (4) Slowly pull the silicon wafer soaked in water, 50S to completely lift the silicon wafer from the water, and then dry it.
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