Flat multichip packaging piece with stamping frame with square groove and production method of flat multichip packaging piece
A technology of multi-chip packaging and square grooves, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems such as performance degradation, product defects, failures, etc., to reduce the possibility of delamination, Improve product reliability and solve the effect of high cost
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[0015] As shown in the figure, a flat multi-chip package with a stamping frame with a square groove is mainly composed of a lead frame 1, a square groove 5, a lower chip 3, an upper chip 8, a lower adhesive sheet 2, and an upper adhesive sheet. The glue 7, the lower bonding wire 4, the middle bonding wire 9, the upper bonding wire 10 and the plastic sealing body 6 are composed; the lead frame 1 is provided with a square groove 5, and the lead frame 1 is connected with The lower chip 3 is bonded, the lower chip 3 is bonded to the upper chip 8 through the upper adhesive sheet 7, the lower bonding wire 4 is connected to the lead frame 1 and the lower chip 3, and the middle bonding wire 9 is connected to the lower bonding wire. Sheet glue 2 and upper sheet glue 7, the upper bonding wire 10 connects the upper sheet glue 7 and the lead frame 1, the plastic package 6 surrounds the lead frame 1, the lower chip 3, the upper chip 8, and the lower sheet glue 2. The upper adhesive 7, the ...
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