Composite double-face copper foil substrate and manufacturing method thereof

Abstract

The invention discloses a composite double-face copper foil substrate and a manufacturing method thereof. The composite double-face copper foil substrate is manufactured by the following steps: hotly pressing a non-adhesive single-face copper-clad plate and an adhesive copper-clad plate at a low temperature, wherein the non-adhesive copper-clad plate comprises a copper foil and an insulating base layer which is formed on one surface of the copper foil; and the adhesive copper-clad plate comprises another copper foil and an insulating bonding glue layer which is coated on one surface of the copper foil; high temperature pressing process in the prior art is avoided; the composite double-face copper foil substrate needed by characteristics of a non-adhesive double-face plate can be satisfied; the production cost is saved, the product production yield is increased and the use range of the product is expanded; moreover, the composite double-face copper foil substrate disclosed by the invention has the advantages of excellent dimension stability, excellent bending resistance, color shielding effect, high heat resistance and high reflectivity.

Description

technical field [0001] The invention belongs to the field of flexible printed circuit board structure and technology, and specifically relates to a composite double-sided copper foil substrate and a manufacturing method thereof. Background technique [0002] At present, the development trend of the global electronics industry is developing in the direction of light and thin, high heat resistance, multi-functionality, high density, high reliability, and low cost. Therefore, the selection of substrates has become a very important factor. A good substrate must have the material properties of high thermal conductivity, high dimensional stability, high color shielding effect, high heat dissipation, high heat resistance, and low thermal expansion coefficient. Polyimide resin has high thermal stability and excellent heat dissipation, mechanical strength, and adhesiveness, and is often used in various electronic materials, such as flexible printed circuit boards (Flexible Printed Ci...

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Problems solved by technology

Although the original intention of the patent 200810217932.6 is to provide a method that can overcome the shortcomings of the difficulty of thinning and poor dimensional stability in the manufacture of double-sided flexible copper clad laminates by the three-layer method, as well as the high cost and poor appearance of the two-layer flexible cover film , and excellent overall performance, low cost, double-sided flexible copper-clad laminate and its manufacturing method that can realize the thinning of the base material, but it will have the following defects in actual production: the production process is relatively difficult, and the equipment needs to control the tension It is very good. After the adhesive layer is applied, it is easy to produce wrinkles in the pressing section, the length cannot be made long, and the yield rate is not high. The yield rate is only about 30%.

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