Spherical pneumatic leveling mechanism

Abstract

The invention relates to a spherical pneumatic balancing mechanism. The spherical pneumatic balancing mechanism comprises a support and an upper plate, wherein a plurality of air outlets are uniformly distributed on a spherical concave surface of the support, and a throttling cover with a throttling hole, which is consistent with the spherical concave surface, is fixedly connected on the air outlets. An air outlet end of the throttling hole is positioned between the support and the upper plate, and an inlet end of the throttling hole is positioned at an outlet of a ventilation channel in the support. The throttle cover is corresponding to the ventilation channel of the support. After being combined, the ventilation channel is communicated with both a compressed air source and a vacuum source. A sucker of the upper plate and an annular slot of a bearing platform are communicated with the vacuum source. Compressed air entering into the part between the support and the upper plate forms an air film to enable the upper plate to float. The bearing platform is adsorbed by the upper plate in a vacuum mode, and a substrate is adsorbed by the bearing platform in a vacuum mode. After floating through the air film, the upper plate can easily balance the substrate, and the balancing force is small. The friction between the upper plate and the support is small, the service lives of the upper plate and the service life of the support are prolonged. The compressed air is switched into vacuum, and the upper plate and the substrate are locked, so that the movement of the substrate along the X direction and the Y direction can not be generated, and the damage ratio of the substrate is reduced.

Description

technical field [0001] The invention relates to a leveling mechanism for aligning a workbench of a contact-proximity lithography machine, in particular to a spherical pneumatic leveling mechanism for a contact-proximity lithography machine to align a workbench. Background technique [0002] The leveling mechanism is the key device in the alignment of the workbench components of the contact proximity lithography machine, and it is also a bottleneck technology. This device directly reflects the technical level of the contact proximity lithography machine's research, production, manufacturing, and assembly. Due to the non-parallel upper and lower surfaces of the substrate, a wedge-shaped angle will be formed between the substrate and the surface of the mask after being adsorbed and fixed. The leveling mechanism is to eliminate this wedge-shaped error and make the substrate and the mask completely contact. , the contact surfaces are parallel. The leveling mechanisms of foreign ...

AI Technical Summary

Problems solved by technology

The leveling mechanism currently configured in domestic contact proximity lithography machines generally adopts hemispherical leveling technology. During leveling, due to the direct contact between the convex and concave hemispherical surfaces, the relative movement is frequent and the wear is fast. After wear, it cannot be repaired and can only be replaced; and leveling Large force can easily cause deformation of the mask and affect the exposure quality of the substrate, especially for thin substrates, it is easy to cause debris

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