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Full-closed cascading micro mechanical filter of micro shielding structure

A technology of shielding structure and filter, applied in the direction of waveguide type devices, electrical components, circuits, etc., to achieve the effect of reducing physical size, reducing microwave leakage, and enhancing clutter suppression capability

Active Publication Date: 2014-11-26
NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Enabling structures that would otherwise be difficult to achieve

Method used

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  • Full-closed cascading micro mechanical filter of micro shielding structure
  • Full-closed cascading micro mechanical filter of micro shielding structure
  • Full-closed cascading micro mechanical filter of micro shielding structure

Examples

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Embodiment

[0025] Example, combined with figure 1 , 2 , 3,

[0026] The embodiment of the present invention provides a micro-shielded, fully sealed, laminated micromechanical (MEMS) filter, which includes an upper substrate 101 and a lower substrate 102, and the upper substrate 101 is etched to form input through holes 107 and The output through hole 108 is used to integrate the upper substrate 101 and the lower substrate 102 of the filter through a micromechanical MEMS alignment bonding process;

[0027] The material of the upper substrate 101 is 400um high-resistance silicon, and the material of the lower substrate 102 is 400um high-resistance silicon; the upper surface of the lower substrate 102 is deposited with metal to form a microwave coupling line resonator 103, the lower substrate input signal interface transmission line 103_1 and the lower substrate Bottom output signal interface transmission line 103_2, deposit metal on the lower surface of the lower substrate 102 to form th...

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Abstract

The invention relates to a full-closed cascading micro mechanical filter of a micro shielding structure, and the filter structurally comprises an upper layered substrate and a lower layered substrate, wherein the upper layered substrate and the lower layered substrate are integrated through a micro mechanical alignment bonding process. A microwave signal is transmitted to the transmission wire of an input signal interface of the lower layered substrate from the input end of the filter of the upper layered substrate; the signal output end of the lower layered substrate is connected to the output end of the filter of the upper layered substrate through an output through hole; the lower surface of the lower layered substrate of the filter is a lower layered grounding surface; parts on the upper surface of the upper layered substrate other than graphics on the input end and the output end of the filter form an upper layered grounding surface; and the upper layered grounding surface and the lower layered grounding surface are electrically connected through a metal through hole array. The full-closed cascading micro mechanical filter of the micro shielding structure has the advantages that an upper wafer and a lower wafer are connected by the signal through a three-dimensional through hole, the sizes of the upper layered substrate and the lower layered substrate are the same, so that the physical sizes of input and output interfaces are reduced; a full-closed structure is adopted, so that microwave leakage is reduced; and pollution of water flow, chips and the like in chip separation and other post processes to the internal structure of a chip is avoided.

Description

technical field [0001] The invention relates to a filter in the microwave working frequency band, in particular to a fully-sealed laminated micro-mechanical filter with a micro-shielding structure, and belongs to the cross-technical field of microwave circuits, microelectronics and micromechanical (MEMS) systems. Background technique [0002] Microwave filters are widely used in satellite, communication, aviation, aerospace and other electronic systems to select and transmit passband signals and filter out stopband signals. With the development of modern technology, such electronic systems are required to be small in size, high in reliability and low in cost. However, general filters are difficult to adapt to the miniaturization, integration and lightweight requirements of modern communication systems due to their own limitations: traditional cavity filters are large in size, and they cannot be monolithically integrated with signal processing circuits, which limits The mini...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P1/20H01P11/00
Inventor 郁元卫侯芳朱健姜国庆朱锋
Owner NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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