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Automatic generation method of printed circuit board thermal simulation metal path line area ratio

A metal trace and area ratio technology, applied in special data processing applications, instruments, electrical digital data processing, etc., can solve problems such as error-prone and low efficiency, and achieve the effect of improving efficiency and accuracy

Inactive Publication Date: 2013-04-24
AVIC NO 631 RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In order to solve the technical problems of error-prone and low-efficiency in the existing printed board thermal simulation, the present invention provides a method for generating the area ratio of printed board metal traces for thermal simulation by using a macro program in CAM350 software

Method used

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  • Automatic generation method of printed circuit board thermal simulation metal path line area ratio
  • Automatic generation method of printed circuit board thermal simulation metal path line area ratio
  • Automatic generation method of printed circuit board thermal simulation metal path line area ratio

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Embodiment Construction

[0028] The operation process of the present invention is specifically described below in conjunction with accompanying drawing:

[0029] The present invention is made based on CAM350 software. When obtaining the metal trace area ratio, the program guides the computer to complete the corresponding operation to obtain the area ratio. The specific operation process is as follows:

[0030] 1] Manually import the photopainting file of the printed board into the CAM software, set the type of each layer, and the layer setting interface is as follows figure 1 shown;

[0031] 2] The program scans the types of each layer and stores them in corresponding variables and arrays;

[0032] 3] Program operation Click the border line of the printed board with the mouse, convert the border line into a line connected end to end, and copy it to a new layer, the interface is as follows image 3 shown;

[0033] 4], the program displays the border line layer, click the inside of the border line wi...

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PUM

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Abstract

The invention relates to an automatic generation method of printed circuit board thermal simulation metal path line area ratio. The method comprises leading-in light painting files, setting layer types, measuring areas and the like. Users only need to manually and correctly lead in light painting files of a printed circuit board signal layer and an electric layer and set types of each layer, then follow-up steps are executed though programs, manual operation is not required, and more accurate parameters are provided for thermal simulation, efficiency and accuracy of thermal simulation are improved, and simulation operators can obtain real cooling information of the printed circuit board.

Description

technical field [0001] The invention belongs to the field of printed board production and relates to a method for automatically generating parameters for thermal simulation of printed boards. Background technique [0002] Printed board users often require printed board manufacturers to provide PCB board design parameters for thermal simulation. Through thermal simulation, the heat dissipation of printed boards can be simulated, so that designers can make timely adjustments to meet the heat dissipation requirements of printed boards. [0003] During the thermal simulation process, the metal area trace ratio still needs to be measured and calculated. At present, the acquisition of the metal trace area ratio is generally carried out in the CAM software. The specific steps are as follows: [0004] 1. Import the light drawing files of the signal layer and electrical layer of the printed board into the CAM software; [0005] 2. Use the area measurement function in the CAM softwar...

Claims

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Application Information

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IPC IPC(8): G06F17/50
Inventor 吴恒冯波
Owner AVIC NO 631 RES INST
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