Radiating block of liquid cooling type central processing unit (CPU) radiator and manufacturing method of the radiating block

Abstract

The invention discloses a radiating block of a liquid cooling type central processing unit (CPU) radiator and a manufacturing method of the radiating block. The radiating block of the liquid cooling type CPU radiator comprises a substrate with a top surface and a base surface and a fin group which is used for dissipating heat and is arranged on the substrate, wherein an inwards concave groove is arranged in the middle portion of the substrate, the fin group is composed of fins which extend outward vertically from the bottom wall of the groove and are aligned in a parallel mode, notches are arranged in top edges of a plurality of fins or all fins of the fin group, and a diversion groove which continuously penetrates through the top ends of the plurality of fins or all fins are formed through all the notches. The method for manufacturing the radiating block of the liquid cooling type CPU radiator comprises steps of manufacturing semi-finished product radiating block, the diversion groove, the groove, the fins and molding the radiating block. By means of the radiating block of the liquid cooling type CPU radiator, heat conduction and heat dispersion of the radiating block are improved.

Description

technical field [0001] The invention relates to the field of CPU radiators, in particular to a heat dissipation block of a liquid-cooled CPU radiator and a manufacturing method thereof. Background technique [0002] The radiating block of existing CPU radiator generally comprises base plate and a plurality of fins that are arranged on base plate and is used for heat dissipation, and fin thickness is between 0.2-0.3mm, and fin is located on base plate top surface and from top surface. It grows on the surface, while the bottom surface of the substrate is treated with a surface drawing treatment process. [0003] The existing cooling blocks have the following problems: [0004] 1. The thickness of the substrate is too thick, resulting in a small number of fins per unit area and a small heat dissipation surface area, which affects heat conduction; [0005] 2. The fins grow on the top surface of the substrate, resulting in a thicker thickness at the contact part with the CPU, t...

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Problems solved by technology

[0004] 1. The thickness of the substrate is too thick, resulting in a small number of fins per unit area and a small heat dissipation surface area, which affects heat conduction;

[0005] 2. The fins grow on the top surface of the substrate, resulting in a thicker thickness at the contact part with the CPU, thereby forming thermal resistance and affecting heat conduction;

[0006] 3. The bottom surface of the substrate is processed by wire drawing process, because the wire drawing process has large flatness and large roughness, which affects heat conduction;

[0007] 4. The heat dissipation block is not equipped with a diversion groove for the coolant of the liquid cooling device to reach the core part of the heat source of the heat dissipation block more quickly, resulting in a large flow resistance of the water flow, thereby affecting the heat dissipation effect

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