High-density high-temperature heat-shrinkable pressure-sensitive tape and preparation method thereof

A high-density, pressure-sensitive tape technology, applied in the direction of film/sheet adhesives, adhesives, etc., can solve the problems of loose soil backfill, plastic deformation of the substrate, failure, etc., to achieve simple installation process, improved work efficiency, and anti-corrosion. Reliable effect

Active Publication Date: 2013-05-08
CYG CHANGTONG NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When this kind of base material is used together with hot melt adhesive, because the high temperature shear of hot melt adhesive is relatively large, and at the same time, the traditional heat shrinkable tape is used for new pipeline joints, and it is generally relatively compact after backfilling, so the base material is squeezed by soil stress. There will be no deformation of the substrate when pressed; when used with pressure-sensitive adhesives,

Method used

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  • High-density high-temperature heat-shrinkable pressure-sensitive tape and preparation method thereof
  • High-density high-temperature heat-shrinkable pressure-sensitive tape and preparation method thereof
  • High-density high-temperature heat-shrinkable pressure-sensitive tape and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] By weight percentage, the formula is: high-density polyethylene (5000s) 72.0%; medium-density polyethylene (m3410) 9.5%; linear low-density polyethylene (FB3003) 15.5%; primary antioxidant (1010) 0.6%; Antioxidant (DSTP) 0.4%: black masterbatch, 2.0%.

[0033] 1. Weigh according to the formula according to the mass ratio, and after uniform mixing, pass through a twin-screw extruder to extrude the granulated material;

[0034] 2. Add the uniformly mixed substrate raw materials into the discharge port of the twin-screw extruder, extrude and granulate to obtain substrate pellets:

[0035] 3. The obtained high-density polyethylene substrate granulation material is dried and transported to the discharge port of the single-screw extruder, and then extruded and cut into semi-finished products;

[0036] 4. The extruded sheet is cross-linked by electron accelerator radiation and ready for use.

Embodiment 2

[0038] By weight percentage, the formula is: high-density polyethylene 65%; medium-density polyethylene 12%; linear low-density polyethylene 20%; primary antioxidant 10760.5%; secondary antioxidant DLTP 0.5%; black masterbatch 2%.

[0039] 1. Weigh according to the formula according to the mass ratio, and after uniform mixing, pass through a twin-screw extruder to extrude the granulated material;

[0040] 2. Add the uniformly mixed substrate raw materials into the discharge port of the twin-screw extruder, extrude and granulate to obtain substrate pellets:

[0041] 3. The obtained high-density polyethylene substrate granulation material is dried and transported to the discharge port of the single-screw extruder, and then extruded and cut into semi-finished products;

[0042] 4. The extruded sheet is cross-linked by electron accelerator radiation and ready for use.

[0043] The pressure-sensitive tape substrates obtained in Examples 1 and 2 were subjected to performance tests,...

Embodiment 3

[0049] By weight percentage, the formula is: butyl rubber (IIR268) 7%, high molecular weight polyisobutylene (PIB100) 13.5%; medium molecular weight polyisobutylene (PIB50) 15%; low molecular weight polyisobutylene (PIB6240) 10%; tackifying resin (Terpene T-100) 12.5%; barium sulfate, 40%; antioxidant (1010) 1%; antioxidant (268) 0.5%; black masterbatch 0.5% and mix well. Mixed by a kneader to make cement; then the uniformly mixed cement was transported to the discharge port of the extruder by a gear pump, extruded and coated on the base material obtained in Example 1, and pressed into a finished product. Among them, the thickness of the substrate is 1.2mm, and the thickness of the adhesive layer is 1.3mm.

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Abstract

The invention provides a high-density high-temperature heat-shrinkable pressure-sensitive tape and a preparation method thereof. The high-density high-temperature heat-shrinkable pressure-sensitive tape comprises the following components in percentage by weight: 6-12% of butyl rubber, 8-15% of high-molecular-weight polyisobutylene, 14-19% of medium-molecular-weight polyisobutylene, 8-12% of low-molecular-weight polyisobutylene, 9-15% of tackifying resin, 30-45% of inorganic reinforcing powder, 0.5-1% of antioxidant, 0.5-1% of anti-aging agent and 0.5-1% of black color master batch. The heat-shrinkable pressure-sensitive adhesive tape provided by the invention is a novel material for pipeline joint coating, and is a high-performance butyl rubber modified pressure-sensitive adhesive. When being applied to onto a radiation crosslinking polyethylene substrate to form a heat-shrinkable pressure-sensitive joint coating material, the problems of in-service pipeline joint coating overhaul and new pipeline joint coating corrosion resistance can be simultaneously solved.

Description

technical field [0001] The invention relates to a high-density, high-temperature heat-shrinkable pressure-sensitive tape and a preparation method thereof. Background technique [0002] At present, the heat-shrinkable pressure-sensitive tapes produced in China use the same radiation cross-linked polyethylene as the traditional heat-shrinkable tape as the base material, and the radiation cross-linked polyethylene base material is mostly low- and medium-density polyethylene. This substrate has a high yield strength at normal temperature, but a low yield strength at high temperature. When this kind of base material is used together with hot melt adhesive, because the high temperature shear of hot melt adhesive is relatively large, and the traditional heat shrinkable tape is used for new pipeline joints, it is generally relatively compact after backfilling, so the base material is squeezed by soil stress. There will be no deformation of the substrate when pressed; when used with...

Claims

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Application Information

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IPC IPC(8): C08L23/06C08L23/08C09J123/22C09J123/20C09J7/02B29C47/92B29C48/92
CPCB29C48/0022B29C48/04B29C48/385B29C48/397B29C48/40B29C48/92
Inventor 徐焕辉谭南枢陈君易杜张真易
Owner CYG CHANGTONG NEW MATERIAL
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