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Peripheral component interconnect extensions for instrumentation (PXI) heat dissipation case and PXI test system

A chassis and heat dissipation fan technology, applied in the field of measurement and control, can solve the problems of low heat dissipation efficiency, affecting the stability of the PXI chassis, and cannot meet the heat dissipation requirements of the PXI chassis, so as to achieve the effect of improving heat dissipation efficiency and heat dissipation performance

Inactive Publication Date: 2013-05-08
NAT INSTR CORP
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  • Abstract
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AI Technical Summary

Problems solved by technology

[0003] Heat dissipation performance is one of the important performances of PXI chassis, poor heat dissipation will seriously affect the stability of PXI chassis operation
In the prior art, cooling fans are usually installed in the PXI chassis to dissipate heat, but the heat dissipation structure of simply using the cooling fan has low heat dissipation efficiency and cannot meet the heat dissipation requirements of the PXI chassis

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  • Peripheral component interconnect extensions for instrumentation (PXI) heat dissipation case and PXI test system
  • Peripheral component interconnect extensions for instrumentation (PXI) heat dissipation case and PXI test system
  • Peripheral component interconnect extensions for instrumentation (PXI) heat dissipation case and PXI test system

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Embodiment Construction

[0018] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0019] figure 1 A schematic diagram of an optional internal structure of the PXI heat dissipation chassis provided by the embodiment of the present invention; figure 2 It is a schematic diagram of an optional cross-sectional structure of the PXI cooling chassis provided by the embodiment of the present invention. like figure 1 and figur...

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Abstract

The invention relates to a peripheral component interconnect extensions for instrumentation (PXI) heat dissipation case and a PXI test system, wherein the PXI heat dissipation case comprises a case shell body and PXI backplanes which are respectively arranged in the case shell body, a plurality of PXI groove positions are arranged in the PXI backplanes, and back face of the case shell body is an air inlet gridding surface. A heat dissipation fan is arranged in the position, adjacent to the air inlet gridding surface, in the case shell body, and an air guide duct is formed between a blow-off nozzle of the heat dissipation fan and the PXI groove positions and used for guiding the wind blown by the heat dissipation fan to the PXI groove positions. Heat dissipation efficiency is improved, and heat dissipation performance of the PXI case is improved.

Description

technical field [0001] The invention relates to measurement and control technology, in particular to a PXI cooling case and a PXI testing system. Background technique [0002] PXI (PCI eXtensions for Instrumentation, PCI extensions for instrumentation systems) is a rugged PC-based measurement and automation platform. PXI combines the electrical bus characteristics of PCI with the ruggedness, modularity, and mechanical packaging of Eurocard of CompactPCI, and adds a dedicated synchronization bus and major software features. This makes PXI a high-performance, low-cost delivery platform for measurement and automation systems. PXI systems can be used in various fields such as manufacturing test, military and aerospace, machine monitoring, automotive production, and industrial testing. [0003] The heat dissipation performance is one of the important performances of the PXI chassis, and poor heat dissipation will seriously affect the stability of the PXI chassis. In the prior ...

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Application Information

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IPC IPC(8): G06F1/20G06F1/18
Inventor 张金权姜雷徐世昌马恩云孙娴汪海波高向东
Owner NAT INSTR CORP
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