A moisture-proof treatment method for electronic circuit boards

Abstract

The invention relates to a damp-proof processing method of an electronic circuit board. The damp-proof processing method of the electronic circuit board comprises the following steps that pre-covering processing is conducted on the electronic circuit board; an automatic spray gun conducts automatic and reciprocating spraying and coating on the electronic circuit board along the horizontal direction and the perpendicular direction; a face is turned automatically according to damp-proof requirements; and the sprayed and coated electronic circuit board is automatically heated and dried. According to the damp-proof processing method of the electronic circuit board, the electronic circuit board is ideal in damp-proof effect and reliable in quality guarantee and work efficiency, and therefore good performance of the electronic circuit board is guaranteed.

Description

technical field [0001] The invention relates to the technical field of processing electronic circuit boards, in particular to a moisture-proof processing method for electronic circuit boards. Background technique [0002] The harm caused by improper moisture-proof treatment of electronic circuit boards is mainly due to the fact that moisture can penetrate the IC plastic package and invade the interior of the IC from the gaps such as pins, resulting in IC moisture absorption, which in turn oxidizes the metal inside the IC device and reduces the insulation performance, resulting in product failure. Fault. Therefore, the moisture-proof treatment of the electronic circuit board becomes an important part of improving the working reliability and stability of the electronic circuit board. [0003] The moisture-proof treatment of electronic circuit boards in the prior art generally includes three treatment methods such as brushing, dipping and spraying. [0004] But the inventor o...

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Problems solved by technology

[0005] 1. Various electrical components of different specifications and heights are installed on the surface of the electrical circuit board. Whether it is artificial brushing or spraying, it is difficult to meet the requirements of uniform moisture-proof spraying coverage and no dead ends.

[0006] 2. The uniformity and consistency of the artificial moisture-proof agent treatment are poor, and it is easy to cause undesirable phenomena such as missed brushing and uneven coating thickness, low work efficiency and poor quality stability

[0007] The existing invention patent "A Moisture-proof Process for Electronic Circuit Boards" (patent publication number CN102196674A) discloses a moisture-proof process for electronic circuit boards based on the above-mentioned shortcomings of the prior art: it is proposed to use two dipping paint treatments for electronic circuit boards, In order to achieve the beneficial effect of moisture-proof treatment of electronic circuit boards, but the inventors found that the treatment method of secondary dip coating can not meet the moisture-proof treatment of various electronic circuit boards

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