3results about How to "Control coating thickness" patented technology

A gluing device for an MESA wafer is provided with a rack, a glue spraying groove, a vacuum suction cup, a nozzle and a nozzle position adjusting mechanism. A glue spraying groove is embedded in a workbench of the rack; the vacuum chuck is fixed in the glue spraying groove; the nozzle is provided with a liquid collecting cavity and glue spraying holes, the liquid collecting cavity is an inverted frustum-shaped cavity, the glue spraying holes are formed in the circular bottom face of the liquid collecting cavity and distributed in a multi-layer annular mode, and the axial section of each glue spraying hole located in the center of the circular bottom face of the liquid collecting cavity is of an isosceles trapezoid structure. The axial sections of the other glue spraying holes surrounding the center position are all of right trapezoid structures, the right-angle sides of the right trapezoid structures are located on the sides close to the glue spraying holes in the center position, and the bevel edges are located on the sides away from the glue spraying holes in the center position; and the nozzle position adjusting mechanism is assembled with the nozzle and is arranged above the working table of the rack. According to the utility model, the photoresist is uniformly coated on the MESA wafer, and the purposes of ensuring the wafer gluing quality and reducing the wafer breakage rate are achieved.

This utility model discloses a switch cover gluing mechanism and a gluing machine. The switch cover gluing mechanism includes a feeding component, a gluing component, and a transverse clamping component. The feeding component uses a vibratory feeder to automatically sort the covers, and works with a feeding plate with a material receiving groove and a feeding cylinder to accurately push the covers to the initial station, solving the problem of cover misalignment at the end of the track. The gluing component uses a glue-holding trough with the middle higher than the sides, and a silicone scraper moves back and forth to achieve uniform glue application. At the same time, a top-loading module holds the cover from the bottom to prevent displacement during gluing. The transverse clamping component includes a transverse drive and a clamping module, which clamps the cover and moves it between the initial station of the feeding component, the gluing station of the gluing component, and subsequent processing stations. This application achieves automated and precise feeding, uniform gluing, and efficient transfer of covers, improving switch production efficiency and product qualification rate.

The application discloses a modification method for realizing the conductivity of basalt fiber. The method forms a conductive polymer on the surface of the basalt fiber through an in-situ polymerization method, so that the basalt fiber is endowed with conductivity. The method can control the particle size of the conductive polymer, the coating thickness and the conductivity of the basalt fiber by adjusting experimental parameters such as the types and concentrations of monomers, oxidants and dopants and the polymerization reaction time. The method is simple and efficient in manufacturing process, and is strong in controllability of structure and performance. The modified basalt fiber has good conductivity, and the resistivity of the basalt fiber is adjustable in the range of 1~10 ‑3 Ω·cm, which widens the application of the basalt fiber in the fields of electromagnetic shielding and electrostatic protection. Moreover, the method does not damage the structure of the fiber itself while realizing the conductivity of the basalt fiber, and improves the mechanical performance of the basalt fiber to a certain extent.