Light-sensitive resin composition, a dry film solder resist and a circuit substrate

A technology of photosensitive resin and composition, applied in secondary processing of printed circuits, photosensitive materials for opto-mechanical equipment, optics, etc. The effect of excellent cross-linked structure

Inactive Publication Date: 2013-05-15
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as the light intensity is increased and thus the film is further photocured, the plating characteristics can be improved, but at the same time the patterning ability may be degraded and high intensity light reduces processability

Method used

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  • Light-sensitive resin composition, a dry film solder resist and a circuit substrate
  • Light-sensitive resin composition, a dry film solder resist and a circuit substrate
  • Light-sensitive resin composition, a dry film solder resist and a circuit substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0132] (1) Preparation of photosensitive resin composition

[0133] Mix 40% by weight of CCR-1235 from Nippon Kayaku, Co., Ltd. as an acid-modified oligomer, 10% by weight of DPEA-12 from Kayarad as a photopolymerizable monomer, 4% by weight of TPO As a photoinitiator, 1% by weight of ITX (a mixture of 2-isopropylthioxanthone and 4-isopropylthioxanthone at a molar ratio of 1:1), 15% by weight of ITX from Nippon Kayaku Co., Ltd. .The EOCN-1020 as epoxy resin, 0.1% by weight of dicyandiamide as epoxy curing agent, 0.1% by weight of 2MI as epoxy catalyst, 15% by weight of BaSO 4 As filler, 0.2% by weight of Pigment Blue 15:3 and 0.2% by weight of Pigment Yellow 151 as pigment, 0.3% by weight of BYK-380N as leveling agent, 0.1% by weight of Disperbyk-110 as dispersant, and 14% by weight DMF as a solvent to provide a photosensitive resin composition.

[0134] (2) Preparation of dry film

[0135] The photosensitive resin composition prepared as above was applied to a PET film as ...

Embodiment 2

[0140] Prepare the photosensitive resin composition with the same method as described in the previous example 1, the difference is to use 4% by weight of I651 as a photoinitiator and use 1% by weight of ITX, and then use the same method as described in the previous example 1 Printed circuit boards were prepared in the same manner.

Embodiment 3

[0142] A photosensitive resin composition was prepared in the same manner as described in the previous example 1, except that 3.5% by weight of TPO was used as a photoinitiator and 1.5% by weight of ITX was used, and then as described in the previous example 1 Printed circuit boards were prepared in the same manner.

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Abstract

The present invention relates to a light-sensitive resin composition comprising an acid-modifiable oligomer, a photopolymerisable monomer, a heat-curable binder resin, a photoinitiator and a thioxanthone compound, to a dry film solder resist obtained from the resin composition, and to a circuit substrate comprising the dry film solder resist.

Description

technical field [0001] The present invention relates to a photosensitive resin composition, a dry film solder mask, and a circuit board, and the present invention is directed to a photosensitive resin composition, a dry film capable of providing a photosensitive material superior in photocuring characteristics, plating resistance, mechanical characteristics, and heat resistance. A film solder resist film and a circuit board comprising the dry film solder resist film. Background technique [0002] As various electronic devices become smaller and lighter, photosensitive protective films capable of producing fine hole patterns are used in printed circuit boards (PCBs), semiconductor package boards, flexible printed circuit boards (FPCBs), and the like. [0003] Protective films—also known as "solder masks"—often require properties such as developability, high resolution, developable electrical insulation, resistance to solder heat, and resistance to gold plating. In addition t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004
CPCG03F7/033G03F7/032G03F7/035G03F7/029G03F7/0045G03F7/0047H05K3/28
Inventor 崔宝允崔炳株郑遇载李光珠郑珉寿
Owner LG CHEM LTD
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