Method for directly cladding copper by sintering wet-method copper oxide piece

A technology of copper oxide sheet and wet method, which is applied in the field of semiconductor manufacturing, can solve the problems of copper mechanical properties and surface treatment adverse effects, uneven temperature distribution of copper sheet, large change in peel strength, etc., to shorten the process time and achieve fine grain size , Improve the effect of mechanical properties

Inactive Publication Date: 2013-05-22
SHANGHAI SHENHE THERMO MAGNETICS ELECTRONICS CO LTD
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Problems solved by technology

[0003] (1) Uneven oxidation: it will directly bring sintering defects to subsequent sintering, and the peel strength will change greatly
[0004] (2) Conveyor belt traces: Due to the high temperature and oxidation process are conveyed by the conveyor belt, the existence of the mesh of the conveyor belt will affect the uneven temperature distribution of the entire copper sheet, leaving traces of the conveyor belt
[0005] (3) High-temperature annealing and oxidation will be accompanied by the grain growth of copper. In the subsequent sintering process, the grains will continue to grow, which will adversely affect the mechanical properties and surface treatment of copper.

Method used

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  • Method for directly cladding copper by sintering wet-method copper oxide piece

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Embodiment Construction

[0016] The method for sintering and direct copper coating of wet-process copper oxide sheets of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0017] Such as figure 1 As shown, the method for direct copper-clad sintering of wet-process copper oxide sheet of the present invention comprises the following steps:

[0018] (1) Cut the copper strip into copper sheets.

[0019] (2) After brushing, micro-etching, air-drying and other processes to remove oxides and roughen the surface of the copper sheet.

[0020] (3) NaOH and K 2 S 2 o 8 According to K 2 S 2 o 8 27g / L~31g / L, NaOH 3g / L~5g / L or K 2 S 2 o 8 83g / L~90g / L, NaOH 22g / L~31g / L, prepare the treatment solution in a glass or plastic container, and preheat to 35℃~45℃ or 30℃~45℃, and then copper The sheet is immersed in the treatment solution for oxidation, and the oxidation time is 2 min to 10 min or 2 min to 5 min.

[0021] (4) After the oxidation is com...

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Abstract

The invention discloses a method for directly cladding copper by sintering a wet-method copper oxide piece. The method comprises the following steps of: step one, carrying out surface pretreatment on the copper piece; step two, putting the copper piece subjected to surface treatment into a treatment solution to oxidize; step three, washing and drying the oxidized copper piece; step four, putting the dried copper piece into a mold to pre-bend; and step five, putting the pre-bent copper piece on a ceramic piece to sinter. Compared with the high-temperature annealing and oxidation, the wet-method oxidation is beneficial for shorting the procedure time, saves the energy, lowers the cost and needs no equipment such as an annealing furnace. Compared with high-temperature annealing and oxidation, the copper surface of a DBC (Database Computer) produced by wet-method oxidation is fine in grain, the improvement of the mechanical properties of the copper piece is facilitated, and the trace of a conveyer belt is eliminated.

Description

technical field [0001] The invention belongs to the field of semiconductor manufacturing, and is suitable for the manufacture of direct copper-clad ceramic substrates, in particular to a method for direct copper-clad sintering of wet-process copper oxide sheets. Background technique [0002] At present, the existing industry generally adopts the high-temperature annealing and oxidation of copper sheets and then sinters them in contact with alumina ceramics. However, this method of high-temperature annealing and oxidation has the following disadvantages: [0003] (1) Inhomogeneous oxidation: it will directly bring sintering defects to the subsequent sintering, and the peel strength will change greatly. [0004] (2) Conveyor belt traces: Due to the high temperature and oxidation process are conveyed by the conveyor belt, the existence of the mesh of the conveyor belt will affect the uneven temperature distribution of the entire copper sheet, leaving traces of the conveyor bel...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B37/02
Inventor 井敏贺贤汉
Owner SHANGHAI SHENHE THERMO MAGNETICS ELECTRONICS CO LTD
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